DLPS052 October   2015 DLPA3000

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Parameters
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply and Monitoring
        1. 7.3.1.1 Supply
        2. 7.3.1.2 Monitoring
          1. 7.3.1.2.1 Block Faults
          2. 7.3.1.2.2 Low Battery and UVLO
          3. 7.3.1.2.3 Auto LED Turn Off Functionality
          4. 7.3.1.2.4 Thermal Protection
      2. 7.3.2 Illumination
        1. 7.3.2.1 Programmable Gain Block
        2. 7.3.2.2 LDO Illum
        3. 7.3.2.3 Illumination Driver A
        4. 7.3.2.4 RGB Strobe Decoder
          1. 7.3.2.4.1 Break Before Make (BBM)
          2. 7.3.2.4.2 Openloop Voltage
          3. 7.3.2.4.3 Transient Current Limit
        5. 7.3.2.5 Illumination Monitoring
          1. 7.3.2.5.1 Power Good
          2. 7.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 7.3.2.6 Load Current and Supply Voltage
        7. 7.3.2.7 Illumination Driver Plus Power FETS Efficiency
      3. 7.3.3 DMD Supplies
        1. 7.3.3.1 LDO DMD
        2. 7.3.3.2 DMD HV Regulator
          1. 7.3.3.2.1 Power-Up and Power-Down Timing
        3. 7.3.3.3 DMD/DLPC Buck Converters
        4. 7.3.3.4 DMD Monitoring
          1. 7.3.3.4.1 Power Good
          2. 7.3.3.4.2 Overvoltage Fault
      4. 7.3.4 Buck Converters
        1. 7.3.4.1 LDO Bucks
        2. 7.3.4.2 General Purpose Buck Converters
        3. 7.3.4.3 Buck Converter Monitoring
          1. 7.3.4.3.1 Power Good
          2. 7.3.4.3.2 Overvoltage Fault
        4. 7.3.4.4 Buck Converter Efficiency
      5. 7.3.5 Auxiliary LDOs
      6. 7.3.6 Measurement System
      7. 7.3.7 Digital Control
        1. 7.3.7.1 SPI
        2. 7.3.7.2 Interrupt
        3. 7.3.7.3 Fast-Shutdown in Case of Fault
        4. 7.3.7.4 Protected Registers
        5. 7.3.7.5 Writing to EEPROM
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Setup Using DLPA3000
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Typical Application with DLPA3000 Internal Block Diagram
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 SPI Connections
    4. 10.4 RLIM Routing
    5. 10.5 LED Connection
    6. 10.6 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) (1)
MIN MAX UNIT
Voltage ILLUM_A,B_BOOST –0.3 28 V
ILLUM_A,B_BOOST (10 ns transient) –0.3 30
ILLUM_A,B_BOOST vs ILLUM_A,B_SWITCH –0.3 7
ILLUM_LSIDE_DRIVE –0.3 7
ILLUM_HSIDE_DRIVE –2 28
ILLUM_A_BOOST vs ILLUM_HSIDE_DRIVE -0.3 7
ILLUM_A,B_SW –2 22
ILLUM_A,B_SW (10 ns transient) –3 27
PWR_VIN, PWR1,2,3,4,5,6,7_VIN, VINA, ILLUM_VIN, ILLUM_A,B_VIN, DRST_VIN –0.3 22
PWR1,2,5,6,7_BOOST –0.3 28
PWR1,2,5,6,7_BOOST (10 ns transient) –0.3 30
PWR1,2,5,6,7_SWITCH –2 22
PWR1,2,5,6,7_SWITCH (10 ns transient) –3 27
PWR1,2,5,6,7_FB –0.3 6.5
PWR1,2,5,6,7_BOOST vs PWR1,2,5,6,7_SWITCH –0.3 6.5
CH1,2,3_SWITCH, DRST_LS_IND, ILLUM_A,B_FB –0.3 20
ILLUM_A,B_COMP1,2, INT_Z, PROJ_ON –0.3 7
DRST_HS_IND –18 7
ACMPR_IN_1,2,3, ACMPR_REF, ACMPR_IN_LABB, ACMPR_LABB_SAMPLE, ACMPR_OUT –0.3 3.6
SPI_VIN, SPI_CLK, SPI_MOSI, SPI_SS_Z, SPI_MISO, CH_SEL_0,1, RESET_Z –0.3 3.6
RLIM_K_1,2, RLIM_1,2 –0.3 3.6
DGND, AGND, DRST_PGND, ILLUM_A,B_PGND, PWR1,2,5,6,7_PGND, RLIM_BOT_K_1,2 –0.3 0.3
DRST_5P5V, ILLUM_5P5V, PWR_5P5, PWR3,4_OUT, SUP_5P0V –0.3 7
CH1,2,3_GATE_CTRL –0.3 7
CLK_OUT –0.3 3.6
CW_SPEED_PWM –0.3 7
SUP_2P5V –0.3 3.6
DMD_VOFFSET –0.3 12
DMD_VBIAS –0.3 20
DMD_VRESET –18 7
Source current RESET_Z, ACMPR_OUT 1 mA
SPI_DOUT 5.5
Sink current RESET_Z, ACMPR_OUT 1 mA
SPI_DOUT, INT_Z 5.5
Tstg Storage temperature –65 150 ºC
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.