DLPS052 October   2015 DLPA3000

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Parameters
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply and Monitoring
        1. 7.3.1.1 Supply
        2. 7.3.1.2 Monitoring
          1. 7.3.1.2.1 Block Faults
          2. 7.3.1.2.2 Low Battery and UVLO
          3. 7.3.1.2.3 Auto LED Turn Off Functionality
          4. 7.3.1.2.4 Thermal Protection
      2. 7.3.2 Illumination
        1. 7.3.2.1 Programmable Gain Block
        2. 7.3.2.2 LDO Illum
        3. 7.3.2.3 Illumination Driver A
        4. 7.3.2.4 RGB Strobe Decoder
          1. 7.3.2.4.1 Break Before Make (BBM)
          2. 7.3.2.4.2 Openloop Voltage
          3. 7.3.2.4.3 Transient Current Limit
        5. 7.3.2.5 Illumination Monitoring
          1. 7.3.2.5.1 Power Good
          2. 7.3.2.5.2 Ratio Metric Overvoltage Protection
        6. 7.3.2.6 Load Current and Supply Voltage
        7. 7.3.2.7 Illumination Driver Plus Power FETS Efficiency
      3. 7.3.3 DMD Supplies
        1. 7.3.3.1 LDO DMD
        2. 7.3.3.2 DMD HV Regulator
          1. 7.3.3.2.1 Power-Up and Power-Down Timing
        3. 7.3.3.3 DMD/DLPC Buck Converters
        4. 7.3.3.4 DMD Monitoring
          1. 7.3.3.4.1 Power Good
          2. 7.3.3.4.2 Overvoltage Fault
      4. 7.3.4 Buck Converters
        1. 7.3.4.1 LDO Bucks
        2. 7.3.4.2 General Purpose Buck Converters
        3. 7.3.4.3 Buck Converter Monitoring
          1. 7.3.4.3.1 Power Good
          2. 7.3.4.3.2 Overvoltage Fault
        4. 7.3.4.4 Buck Converter Efficiency
      5. 7.3.5 Auxiliary LDOs
      6. 7.3.6 Measurement System
      7. 7.3.7 Digital Control
        1. 7.3.7.1 SPI
        2. 7.3.7.2 Interrupt
        3. 7.3.7.3 Fast-Shutdown in Case of Fault
        4. 7.3.7.4 Protected Registers
        5. 7.3.7.5 Writing to EEPROM
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Setup Using DLPA3000
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Typical Application with DLPA3000 Internal Block Diagram
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 SPI Connections
    4. 10.4 RLIM Routing
    5. 10.5 LED Connection
    6. 10.6 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

ESD Ratings

VALUE UNIT
V(ESD)(1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(2) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(3) ±500
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.