SNLS676A May   2022  – December 2025 DP83TC813R-Q1 , DP83TC813S-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Diagnostic Tool Kit
        1. 7.3.1.1 Signal Quality Indicator
        2. 7.3.1.2 Electrostatic Discharge Sensing
        3. 7.3.1.3 Time Domain Reflectometry
        4. 7.3.1.4 Voltage Sensing
        5. 7.3.1.5 BIST and Loopback Modes
          1. 7.3.1.5.1 Data Generator and Checker
          2. 7.3.1.5.2 xMII Loopback
          3. 7.3.1.5.3 PCS Loopback
          4. 7.3.1.5.4 Digital Loopback
          5. 7.3.1.5.5 Analog Loopback
          6. 7.3.1.5.6 Reverse Loopback
      2. 7.3.2 Compliance Test Modes
        1. 7.3.2.1 Test Mode 1
        2. 7.3.2.2 Test Mode 2
        3. 7.3.2.3 Test Mode 4
        4. 7.3.2.4 Test Mode 5
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power Down
      2. 7.4.2  Reset
      3. 7.4.3  Standby
      4. 7.4.4  Normal
      5. 7.4.5  Sleep Ack
      6. 7.4.6  Sleep Request
      7. 7.4.7  Sleep Fail
      8. 7.4.8  Sleep
      9. 7.4.9  Wake-Up
      10. 7.4.10 TC10 System Example
      11. 7.4.11 Media Dependent Interface
        1. 7.4.11.1 100BASE-T1 Leader and 100BASE-T1 Follower Configuration
        2. 7.4.11.2 Auto-Polarity Detection and Correction
        3. 7.4.11.3 Jabber Detection
        4. 7.4.11.4 Interleave Detection
      12. 7.4.12 MAC Interfaces
        1. 7.4.12.1 Media Independent Interface
        2. 7.4.12.2 Reduced Media Independent Interface
        3. 7.4.12.3 Reduced Gigabit Media Independent Interface
        4. 7.4.12.4 Serial Gigabit Media Independent Interface
      13. 7.4.13 Serial Management Interface
        1. 7.4.13.1 Direct Register Access
        2. 7.4.13.2 Extended Register Space Access
        3. 7.4.13.3 Write Operation (No Post Increment)
        4. 7.4.13.4 Read Operation (No Post Increment)
        5. 7.4.13.5 Write Operation (Post Increment)
        6. 7.4.13.6 Read Operation (Post Increment)
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
      2. 7.5.2 LED Configuration
      3. 7.5.3 PHY Address Configuration
  9. 8 Register Maps
    1. 8.1 Register Access Summary
    2. 8.2 DP83TC813 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Physical Medium Attachment
          1. 9.2.1.1.1 Common-Mode Choke Recommendations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Signal Traces
        2. 9.4.1.2 Return Path
        3. 9.4.1.3 Metal Pour
        4. 9.4.1.4 PCB Layer Stacking
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

Note:

TI is transitioning to use more inclusive terminology. Some language can be different than what is expected in certain technology areas.