SNLS663A December   2021  – December 2025 DP83TC814R-Q1 , DP83TC814S-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Diagnostic Tool Kit
        1. 7.3.1.1 Signal Quality Indicator
        2. 7.3.1.2 Electrostatic Discharge Sensing
        3. 7.3.1.3 Time Domain Reflectometry
        4. 7.3.1.4 Voltage Sensing
        5. 7.3.1.5 BIST and Loopback Modes
          1. 7.3.1.5.1 Data Generator and Checker
          2. 7.3.1.5.2 xMII Loopback
          3. 7.3.1.5.3 PCS Loopback
          4. 7.3.1.5.4 Digital Loopback
          5. 7.3.1.5.5 Analog Loopback
          6. 7.3.1.5.6 Reverse Loopback
      2. 7.3.2 Compliance Test Modes
        1. 7.3.2.1 Test Mode 1
        2. 7.3.2.2 Test Mode 2
        3. 7.3.2.3 Test Mode 4
        4. 7.3.2.4 Test Mode 5
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down
      2. 7.4.2 Reset
      3. 7.4.3 Standby
      4. 7.4.4 Normal
      5. 7.4.5 Media Dependent Interface
        1. 7.4.5.1 100BASE-T1 Leader and 100BASE-T1 Follower Configuration
        2. 7.4.5.2 Auto-Polarity Detection and Correction
        3. 7.4.5.3 Jabber Detection
        4. 7.4.5.4 Interleave Detection
      6. 7.4.6 MAC Interfaces
        1. 7.4.6.1 Media Independent Interface
        2. 7.4.6.2 Reduced Media Independent Interface
        3. 7.4.6.3 Reduced Gigabit Media Independent Interface
        4. 7.4.6.4 Serial Gigabit Media Independent Interface
      7. 7.4.7 Serial Management Interface
        1. 7.4.7.1 Direct Register Access
        2. 7.4.7.2 Extended Register Space Access
        3. 7.4.7.3 Write Operation (No Post Increment)
        4. 7.4.7.4 Read Operation (No Post Increment)
        5. 7.4.7.5 Write Operation (Post Increment)
        6. 7.4.7.6 Read Operation (Post Increment)
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
      2. 7.5.2 LED Configuration
      3. 7.5.3 PHY Address Configuration
  9. 8 Register Maps
    1. 8.1 Register Access Summary
    2. 8.2 DP83TC814 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Physical Medium Attachment
          1. 9.2.1.1.1 Common-Mode Choke Recommendations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Signal Traces
        2. 9.4.1.2 Return Path
        3. 9.4.1.3 Metal Pour
        4. 9.4.1.4 PCB Layer Stacking
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

DATE REVISION NOTES
December 2021 * Initial Release

Changes from Revision * (December 2021) to Revision A (February 2025)

  • Updated the CLKOUT frequency to be 50MHz in RMII Follower mode in the Pin Configuration and Functions sectionGo
  • Added line to CLKOUT/GPIO2 description about which registers to program to disable switching in the Pin Configuration and Functions sectionGo
  • Added line to INT pin description, "Reg 12-13 is recommended to be read only when INT_N is LOW", in the Pin Configuration and Functions sectionGo
  • Added corrections for maximum clock rate in MDC description of the Pin Functions table Go
  • Updated MDIO pin description to include link to Compliance Test Modes section in the Pin Configuration and Functions sectionGo
  • Removed supply ramp delay offset for all supplies in the Timing Requirements sectionGo
  • Updated Iozh to clarify mapping of Rx_Ctrl and Rx_ER pins in the Electrical Characteristics tableGo
  • Added corrections to the TDR description and deleted Register 0x310, Bit 8 in the Time Domain Reflectometry sectionGo
  • Updated and corrected order of register writes for packet generation in the BIST and Loopback Modes sectionGo
  • Clarified register reads for checking incoming data on the MAC sideGo
  • Added corrections to the RGMII Transmit Encoding table for Normal Data Transmission and Transmit Error Propagation Go
  • Added corrections to the RGMII Transmit Encoding table for Normal Data Transmission and Transmit Error PropagationGo
  • Added correction to note referring to SNLA389 Application Note Go
  • Updated PHY Address Bootstraps: Binary values corrected to match hex settings Go
  • Clarified and updated Bit Descriptions throughout the Registers Go
  • Updated RMII Follower typical application diagram for correct XI configuration in the Typical Applications section Go
  • Updated Typical Application (General) Diagram in the Typical Applications Go
  • Updated RGMII Typical Application diagram to include 25MHz inputGo