SLVSFF0B June   2020  – July 2022 DRV8436E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
    1.     Device Options
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 PWM Motor Drivers
      2. 7.3.2 Bridge Control
      3. 7.3.3 Current Regulation
      4. 7.3.4 Decay Modes
        1. 7.3.4.1 Slow Decay
        2. 7.3.4.2 Mixed Decay
        3. 7.3.4.3 Fast Decay
        4. 7.3.4.4 Smart tune Dynamic Decay
        5. 7.3.4.5 Blanking time
      5. 7.3.5 Charge Pump
      6. 7.3.6 Linear Voltage Regulators
      7. 7.3.7 Logic and Quad-Level Pin Diagrams
        1. 7.3.7.1 nFAULT Pin
      8. 7.3.8 Protection Circuits
        1. 7.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.8.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.8.3 Overcurrent Protection (OCP)
        4. 7.3.8.4 Thermal Shutdown (OTSD)
        5. 7.3.8.5 36
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Operating Mode (nSLEEP = 1)
      3. 7.4.3 Functional Modes Summary
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Primary Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Current Regulation
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Current Regulation
        2. 8.3.2.2 Stepper Motor Speed
        3. 8.3.2.3 Decay Modes
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)PWP (HTSSOP)RGE (VQFN)UNIT
28 PINS24 PINS
RθJAJunction-to-ambient thermal resistance31.341.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance26.032.9°C/W
RθJBJunction-to-board thermal resistance11.518.5°C/W
ψJTJunction-to-top characterization parameter0.50.6°C/W
ψJBJunction-to-board characterization parameter11.518.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.44.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.