SLOSE84B August   2022  – October 2023 DRV8452

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
      1. 6.5.1 SPI Timing Requirements
      2. 6.5.2 STEP and DIR Timing Requirements
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Interface of Operation
      2. 7.3.2  Stepper Motor Driver Current Ratings
        1. 7.3.2.1 Peak Current Rating
        2. 7.3.2.2 RMS Current Rating
        3. 7.3.2.3 Full-Scale Current Rating
      3. 7.3.3  PWM Motor Drivers
      4. 7.3.4  Microstepping Indexer
      5. 7.3.5  Indexer Output
        1. 7.3.5.1 nHOME Output
      6. 7.3.6  Automatic Microstepping Mode
      7. 7.3.7  Custom Microstepping Table
      8. 7.3.8  Current Regulation
        1. 7.3.8.1 Internal Reference Voltage
      9. 7.3.9  Standstill Power Saving Mode
      10. 7.3.10 Current Regulation Decay Modes
        1. 7.3.10.1 Slow Decay
        2. 7.3.10.2 Mixed Decay
        3. 7.3.10.3 Smart tune Dynamic Decay
        4. 7.3.10.4 Smart tune Ripple Control
        5. 7.3.10.5 PWM OFF Time
        6. 7.3.10.6 Current Regulation Blanking Time and Deglitch Time
      11. 7.3.11 Current Sensing with External Resistor
      12. 7.3.12 Silent step decay mode
      13. 7.3.13 Auto-torque Dynamic Current Adjustment
        1. 7.3.13.1 Auto-torque Learning Routine
        2. 7.3.13.2 Current Control Loop
        3. 7.3.13.3 PD Control Loop
        4. 7.3.13.4 Efficiency Improvement with Auto-torque
      14. 7.3.14 Charge Pump
      15. 7.3.15 Linear Voltage Regulator
      16. 7.3.16 VCC Voltage Supply
      17. 7.3.17 Logic Level, Tri-Level and Quad-Level Pin Diagrams
      18. 7.3.18 Spread Spectrum
      19. 7.3.19 Protection Circuits
        1. 7.3.19.1  VM Undervoltage Lockout
        2. 7.3.19.2  VCP Undervoltage Lockout (CPUV)
        3. 7.3.19.3  Logic Supply Power on Reset (POR)
        4. 7.3.19.4  Overcurrent Protection (OCP)
          1. 7.3.19.4.1 Latched Shutdown
          2. 7.3.19.4.2 Automatic Retry
        5. 7.3.19.5  Stall Detection
        6. 7.3.19.6  Open-Load Detection (OL)
        7. 7.3.19.7  Overtemperature Warning (OTW)
        8. 7.3.19.8  Thermal Shutdown (OTSD)
          1. 7.3.19.8.1 Latched Shutdown
          2. 7.3.19.8.2 Automatic Retry
        9. 7.3.19.9  Supply voltage sensing
        10. 7.3.19.10 nFAULT Output
        11. 7.3.19.11 Fault Condition Summary
      20. 7.3.20 Device Functional Modes
        1. 7.3.20.1 Sleep Mode
        2. 7.3.20.2 Disable Mode
        3. 7.3.20.3 Operating Mode
        4. 7.3.20.4 nSLEEP Reset Pulse
        5. 7.3.20.5 Functional Modes Summary
    4. 7.4 Programming
      1. 7.4.1 Serial Peripheral Interface (SPI) Communication
        1. 7.4.1.1 SPI Format
        2. 7.4.1.2 SPI for Multiple Target Devices in Daisy Chain Configuration
        3. 7.4.1.3 SPI for Multiple Target Devices in Parallel Configuration
    5. 7.5 Register Maps
      1. 7.5.1 Status Registers
        1. 7.5.1.1 FAULT (address = 0x00) [Default = 00h]
        2. 7.5.1.2 DIAG1 (address = 0x01) [Default = 00h]
        3. 7.5.1.3 DIAG2 (address = 0x02) [Default = 00h]
        4. 7.5.1.4 DIAG3 (address = 0x03) [Default = 00h]
      2. 7.5.2 Control Registers
        1. 7.5.2.1  CTRL1 (address = 0x04) [Default = 0Fh]
        2. 7.5.2.2  CTRL2 (address = 0x05) [Default = 06h]
        3. 7.5.2.3  CTRL3 (address = 0x06) [Default = 38h]
        4. 7.5.2.4  CTRL4 (address = 0x07) [Default = 49h]
        5. 7.5.2.5  CTRL5 (address = 0x08) [Default = 03h]
        6. 7.5.2.6  CTRL6 (address = 0x09) [Default = 20h]
        7. 7.5.2.7  CTRL7 (address = 0x0A) [Default = FFh]
        8. 7.5.2.8  CTRL8 (address = 0x0B) [Default = 0Fh]
        9. 7.5.2.9  CTRL9 (address = 0x0C) [Default = 10h]
        10. 7.5.2.10 CTRL10 (address = 0x0D) [Default = 80h]
        11. 7.5.2.11 CTRL11 (address = 0x0E) [Default = FFh]
        12. 7.5.2.12 CTRL12 (address = 0x0F) [Default = 20h]
        13. 7.5.2.13 CTRL13 (address = 0x10) [Default = 10h]
      3. 7.5.3 Indexer Registers
        1. 7.5.3.1 INDEX1 (address = 0x11) [Default = 80h]
        2. 7.5.3.2 INDEX2 (address = 0x12) [Default = 80h]
        3. 7.5.3.3 INDEX3 (address = 0x13) [Default = 80h]
        4. 7.5.3.4 INDEX4 (address = 0x14) [Default = 82h]
        5. 7.5.3.5 INDEX5 (address = 0x15) [Default = B5h]
      4. 7.5.4 Custom Microstepping Registers
        1. 7.5.4.1 CUSTOM_CTRL1 (address = 0x16) [Default = 00h]
        2. 7.5.4.2 CUSTOM_CTRL2 (address = 0x17) [Default = 00h]
        3. 7.5.4.3 CUSTOM_CTRL3 (address = 0x18) [Default = 00h]
        4. 7.5.4.4 CUSTOM_CTRL4 (address = 0x19) [Default = 00h]
        5. 7.5.4.5 CUSTOM_CTRL5 (address = 0x1A) [Default = 00h]
        6. 7.5.4.6 CUSTOM_CTRL6 (address = 0x1B) [Default = 00h]
        7. 7.5.4.7 CUSTOM_CTRL7 (address = 0x1C) [Default = 00h]
        8. 7.5.4.8 CUSTOM_CTRL8 (address = 0x1D) [Default = 00h]
        9. 7.5.4.9 CUSTOM_CTRL9 (address = 0x1E) [Default = 00h]
      5. 7.5.5 Auto torque Registers
        1. 7.5.5.1  ATQ_CTRL1 (address = 0x1F) [Default = 00h]
        2. 7.5.5.2  ATQ_CTRL2 (address = 0x20) [Default = 00h]
        3. 7.5.5.3  ATQ_CTRL3 (address = 0x21) [Default = 00h]
        4. 7.5.5.4  ATQ_CTRL4 (address = 0x22) [Default = 20h]
        5. 7.5.5.5  ATQ_CTRL5 (address = 0x23) [Default = 00h]
        6. 7.5.5.6  ATQ_CTRL6 (address = 0x24) [Default = 00h]
        7. 7.5.5.7  ATQ_CTRL7 (address = 0x25) [Default = 00h]
        8. 7.5.5.8  ATQ_CTRL8 (address = 0x26) [Default = 00h]
        9. 7.5.5.9  ATQ_CTRL9 (address = 0x27) [Default = 00h]
        10. 7.5.5.10 ATQ_CTRL10 (address = 0x28) [Default = 08h]
        11. 7.5.5.11 ATQ_CTRL11 (address = 0x29) [Default = 0Ah]
        12. 7.5.5.12 ATQ_CTRL12 (address = 0x2A) [Default = FFh]
        13. 7.5.5.13 ATQ_CTRL13 (address = 0x2B) [Default = 05h]
        14. 7.5.5.14 ATQ_CTRL14 (address = 0x2C) [Default = 0Fh]
        15. 7.5.5.15 ATQ_CTRL15 (address = 0x2D) [Default = 00h]
        16. 7.5.5.16 ATQ_CTRL16 (address = 0x2E) [Default = FFh]
        17. 7.5.5.17 ATQ_CTRL17 (address = 0x2F) [Default = 00h]
        18. 7.5.5.18 ATQ_CTRL18 (address = 0x30) [Default = 00h]
      6. 7.5.6 Silent Step Registers
        1. 7.5.6.1 SS_CTRL1 (address = 0x31) [Default = 00h]
        2. 7.5.6.2 SS_CTRL2 (address = 0x32) [Default = 00h]
        3. 7.5.6.3 SS_CTRL3 (address = 0x33) [Default = 00h]
        4. 7.5.6.4 SS_CTRL4 (address = 0x34) [Default = 00h]
        5. 7.5.6.5 SS_CTRL5 (address = 0x35) [Default = FFh]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
        2. 8.2.4.2 Conduction Loss
        3. 8.2.4.3 Switching Loss
        4. 8.2.4.4 Power Dissipation Due to Quiescent Current
        5. 8.2.4.5 Total Power Dissipation
        6. 8.2.4.6 Device Junction Temperature Estimation
        7. 8.2.4.7 Thermal Images
  10. 9 Thermal Considerations
    1. 9.1 Thermal Pad
    2. 9.2 PCB Material Recommendation
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supplies
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

  • The VM pins should be bypassed to PGND pins using low-ESR ceramic bypass capacitors with a recommended value of 0.01 µF rated for VM. The capacitors should be placed as close to the VM pins as possible with a thick trace or ground plane connection to the device PGND pins.

  • The VM pins should be bypassed to PGND using a bulk capacitor rated for VM. This component can be an electrolytic capacitor.

  • A low-ESR ceramic capacitor must be placed in between the CPL and CPH pins. A value of 0.1 µF rated for VM is recommended. Place this component as close to the pins as possible.

  • A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. A value of 1 µF rated for 16 V is recommended. Place this component as close to the pins as possible.

  • Bypass the DVDD pin to ground with a low-ESR ceramic capacitor. A value of 1 µF rated for 6.3 V is recommended. Place this bypassing capacitor as close to the pin as possible.

  • Bypass the VCC pin to ground with a low-ESR ceramic capacitor. A value of 0.1 µF rated for 6.3 V is recommended. Place this bypassing capacitor as close to the pin as possible.

  • In general, inductance between the power supply pins and decoupling capacitors must be avoided.

  • The thermal PAD of the package must be connected to system ground.

    • It is recommended to use a big unbroken single ground plane for the whole system / board. The ground plane can be made at bottom PCB layer.

    • In order to minimize the impedance and inductance, the traces from ground pins should be as short and wide as possible, before connecting to bottom layer ground plane through vias.

    • Multiple vias are suggested to reduce the impedance.

    • Try to clear the space around the device as much as possible especially at bottom PCB layer to improve the heat spreading.

    • Single or multiple internal ground planes connected to the thermal PAD will also help spreading the heat and reduce the thermal resistance.