4 Revision History
Changes from G Revision (April 2013) to H Revision
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Added Pin Configuration and Functions section, Storage Conditions table, ESD Ratings table, Thermal Information table, Parameter Measurement Information section, Feature Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Changed thermal information per latest modeling resultsGo
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Changed board trace attenuation estimate, per recent measurement Go
Changes from F Revision (April 2013) to G Revision
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Changed layout of National Data Sheet to TI formatGo