SNLS407D April   2012  – October 2014 DS90UB925Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Recommended Timing for the Serial Control Bus
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Charateristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High Speed Forward Channel Data Transfer
      2. 7.3.2  Low Speed Back Channel Data Transfer
      3. 7.3.3  Backward Compatible Mode
      4. 7.3.4  Common Mode Filter Pin (CMF)
      5. 7.3.5  Video Control Signal Filter
      6. 7.3.6  EMI Reduction Features
        1. 7.3.6.1 Input SSC Tolerance (SSCT)
      7. 7.3.7  LVCMOS VDDIO Option
      8. 7.3.8  Power Down (PDB)
      9. 7.3.9  Remote Auto Power Down Mode
      10. 7.3.10 Input PCLK Loss Detect
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 Pixel Clock Edge Select (RFB)
      13. 7.3.13 Low Frequency Optimization (LFMODE)
      14. 7.3.14 Interrupt Pin — Functional Description And Usage (INTB)
      15. 7.3.15 Internal Pattern Generation
      16. 7.3.16 GPIO[3:0] and GPO_REG[8:4]
        1. 7.3.16.1 GPIO[3:0] Enable Sequence
        2. 7.3.16.2 GPO_REG[8:4] Enable Sequence
      17. 7.3.17 I2S Transmitting
        1. 7.3.17.1 Secondary I2S Channel
      18. 7.3.18 Built In Self Test (BIST)
        1. 7.3.18.1 BIST Configuration and Status
          1. 7.3.18.1.1 Sample BIST Sequence
        2. 7.3.18.2 Forward Channel And Back Channel Error Checking
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Select (MODE_SEL)
      2. 7.4.2 Repeater Application
        1. 7.4.2.1 Repeater Configuration
        2. 7.4.2.2 Repeater Connections
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Up Requirements and PDB Pin
    2. 9.2 CML Interconnect Guidelines
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

  • AN-2198 Exploring the Internal Test Pattern Generation SNLA132
  • AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines SNLA008
  • SCAN18245T Non-Inverting Transceiver with TRI-STATE Outputs SNLA035
  • TI Interface Website www.ti.com/lvds
  • AN-1187 Leadless Leadframe Package (LLP) SNOA401
  • Semiconductor and IC Package Thermal Metrics SPRA953

11.2 Trademarks

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.