SNAS678C May   2018  – July 2021 HDC2080

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sleep Mode Power Consumption
      2. 8.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
      3. 8.3.3 Heater
      4. 8.3.4 Interrupt Description
        1. 8.3.4.1 DRDY
      5. 8.3.5 INTERRUPT on Threshold
        1. 8.3.5.1 Temperature High
        2. 8.3.5.2 Temperature Low
        3. 8.3.5.3 Humidity High
        4. 8.3.5.4 Humidity Low
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs. Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
      3. 8.5.3 Serial Bus Address
      4. 8.5.4 Read and Write Operations
    6. 8.6 Register Maps
      1. 8.6.1  Address 0x00 Temperature LSB
      2. 8.6.2  Address 0x01 Temperature MSB
      3. 8.6.3  Address 0x02 Humidity LSB
      4. 8.6.4  Address 0x03 Humidity MSB
      5. 8.6.5  Address 0x04 Interrupt DRDY
      6. 8.6.6  Address 0x05 Temperature MAX
      7. 8.6.7  Address 0x06 Humidity MAX
      8. 8.6.8  Address 0x07 Interrupt Configuration
      9. 8.6.9  Address 0x08 Temperature Offset Adjustment
      10. 8.6.10 Address 0x09 Humidity Offset Adjustment
      11. 8.6.11 Address 0x0A Temperature Threshold LOW
      12. 8.6.12 Address 0x0B Temperature Threshold HIGH
      13. 8.6.13 Address 0x0C Humidity Threshold LOW
      14. 8.6.14 Address 0x0D Humidity Threshold HIGH
      15. 8.6.15 Address 0x0E Reset and DRDY/INT Configuration Register
      16. 8.6.16 Address 0x0F Measurement Configuration
      17. 8.6.17 Manufacturer ID Low
      18. 8.6.18 Manufacturer ID High
      19. 8.6.19 Device ID Low
      20. 8.6.20 Device ID High
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Guidelines for HDC2080 Storage and PCB Assembly
        1. 11.1.1.1 Storage and Handling
        2. 11.1.1.2 Soldering Reflow
        3. 11.1.1.3 Rework
        4. 11.1.1.4 High Temperature and Humidity Exposure
        5. 11.1.1.5 Bake/Re-Hydration Procedure
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision B (May 2019) to Revision C (July 2021)

  • Removed GND pin absolute maximum ratingGo
  • Added DRDY/INT pin absolute maximum ratingGo
  • Added information from multiple table footnotes to Recommended Operating Conditions tableGo
  • Changed temperature accuracy maximum for 5℃ < TA < 60℃Go
  • Added TEMPPSRR parameterGo
  • Changed reference material for Storage and Handling Go
  • Added content to the Heater sectionGo
  • Added 0.5 to make Equation 1 –40.5 match more closely to the silicon and added PSSR equationGo
  • Added 0.5 to make Equation 4 –40.5 match more closely to the silicon and added PSSR equationGo
  • Added 0.5 to make Equation 7 –40.5 match more closely to the silicon and added PSSR equation Go
  • Added 0.5 to make Equation 9 –40.5 match more closely to the silicon and added PSSR equationGo
  • Changed reference material in the Storage and Handling sectionGo
  • Added Typical Relative Humidity Accuracy Range Limits graphic.Go

Changes from Revision A (October 2018) to Revision B (May 2019)

  • Added the pin type for DRDY/INT pin Go
  • Changed description of behavior of TH_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of TH_STATUS bit when INT_MODE is set to 0 Go
  • Changed description of behavior of TL_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of TL_STATUS bit when INT_MODE is set to 0 Go
  • Changed description of behavior of HH_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of HH_STATUS bit when INT_MODE is set to 0Go
  • Changed description of behavior of HL_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of HL_STATUS bit when INT_MODE is set to 0 Go
  • Changed the units for Humidity threshold low from: °C to: %RHGo
  • Changed the temperature resolution decoding from: 8 bit to: 9 bit Go
  • Changed the humidity resolution decoding from: 8 bit to: 9 bit Go
  • Changed the measurement configuration "10" bit encoding from: Humidity Only to: NA for field MEAS_CONF[1:0] Go

Changes from Revision * (May 2018) to Revision A (October 2018)

  • Changed header cell in the Read Single Byte table from: Slave address (R) to: Slave address (W)Go
  • Changed header cell in the Read Multi Byte table from: Slave address (R) to: Slave address (W)Go