SNAS678C May   2018  – July 2021 HDC2080

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sleep Mode Power Consumption
      2. 8.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
      3. 8.3.3 Heater
      4. 8.3.4 Interrupt Description
        1. 8.3.4.1 DRDY
      5. 8.3.5 INTERRUPT on Threshold
        1. 8.3.5.1 Temperature High
        2. 8.3.5.2 Temperature Low
        3. 8.3.5.3 Humidity High
        4. 8.3.5.4 Humidity Low
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs. Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
      3. 8.5.3 Serial Bus Address
      4. 8.5.4 Read and Write Operations
    6. 8.6 Register Maps
      1. 8.6.1  Address 0x00 Temperature LSB
      2. 8.6.2  Address 0x01 Temperature MSB
      3. 8.6.3  Address 0x02 Humidity LSB
      4. 8.6.4  Address 0x03 Humidity MSB
      5. 8.6.5  Address 0x04 Interrupt DRDY
      6. 8.6.6  Address 0x05 Temperature MAX
      7. 8.6.7  Address 0x06 Humidity MAX
      8. 8.6.8  Address 0x07 Interrupt Configuration
      9. 8.6.9  Address 0x08 Temperature Offset Adjustment
      10. 8.6.10 Address 0x09 Humidity Offset Adjustment
      11. 8.6.11 Address 0x0A Temperature Threshold LOW
      12. 8.6.12 Address 0x0B Temperature Threshold HIGH
      13. 8.6.13 Address 0x0C Humidity Threshold LOW
      14. 8.6.14 Address 0x0D Humidity Threshold HIGH
      15. 8.6.15 Address 0x0E Reset and DRDY/INT Configuration Register
      16. 8.6.16 Address 0x0F Measurement Configuration
      17. 8.6.17 Manufacturer ID Low
      18. 8.6.18 Manufacturer ID High
      19. 8.6.19 Device ID Low
      20. 8.6.20 Device ID High
  9. 9  Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Guidelines for HDC2080 Storage and PCB Assembly
        1. 11.1.1.1 Storage and Handling
        2. 11.1.1.2 Soldering Reflow
        3. 11.1.1.3 Rework
        4. 11.1.1.4 High Temperature and Humidity Exposure
        5. 11.1.1.5 Bake/Re-Hydration Procedure
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

TA = 30°C, VDD = 1.8V, 20% ≤ RH ≤ 80% (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER CONSUMPTION
IDD Supply Current RH Measurement(1) 650 890 µA
IDD Supply Current Temperature Measurement(1) 550 730 µA
IDD Supply Current Sleep Mode 0.05 1 µA
IDD Supply Current Averaged at 1 sample per second, RH or Temperature only(1) (2) 0.3 µA
IDD Supply Current Averaged at 1 sample per second, RH (11 bit) and Temperature (11 bit)(1) (2) 0.55 µA
IDD Supply Current Averaged at 1 sample per 2 seconds, RH (11 bit) and Temperature (11 bit)(1) (2) 0.3 µA
IDD Supply Current Averaged at 1 sample per 10 seconds, RH (11 bit) and Temperature (11 bit)(1) (2) 0.105 µA
IDD Supply Current Startup (average on startup time) 80 µA
IHEATER Integrated Heater (when enabled) VDD = 3.3V 90 mA
RELATIVE HUMIDITY SENSOR
RHACC Accuracy(3) (4) 0°C < TA < 60°C. Non-Condensing. ±2 ±3 %RH
RHREP Repeatability(5) 14 bit resolution ±0.1 %RH
RHHYS Hysteresis(6) ±1 %RH
RHHYS Response Time(7) t63% step(8) 8 s
RHCT Conversion-time(5) 9 bit accuracy 275 µs
RHCT Conversion-time(5) 11 bit accuracy 400 µs
RHCT Conversion-time(5) 14 bit accuracy 660 µs
RHLTD Long-term Drift(9) ±0.25 %RH/yr
TEMPERATURE SENSOR
TEMPACC Accuracy (5) 5°C < TA < 60°C ±0.2 ±0.7 °C
10°C < TA < 35°C ±0.2 ±0.4
TEMPREP Repeatability(5) 14 bit resolution ±0.1 °C
TEMPCT Conversion-time(5) 9 bit accuracy 225 µs
TEMPCT Conversion-time(5) 11 bit accuracy 350 µs
TEMPCT Conversion-time(5) 14 bit accuracy 610 µs
TEMPPSRR  Supply Sensitivity on accuracy VDD = 1.8V to 3.6V 0.08 ℃/V
SCL, SDA PINS
VIH HIGH-level input voltage 0.7 x VDD V
VIL LOW-level input voltage 0.3 x VDD V
VOL LOW-level output voltage IOL = 3 mA 0.4 V
VHYS Hysteresis of Schmitt trigger inputs 0.1 x VDD V
CIN Input Capacitance (5) 0.5 pF
(1) Does not include I2C read/write communication or pullup resistor current through SCL and SDA
(2) Average current consumption while conversion is in progress
(3) Excludes hysteresis and long-term drift
(4) Excludes the impact of dust, gas phase solvents and other contaminents such as vapors from packaging materials, adhesives, or taptes, etc.
(5) This parameter is specified by design and/or characterization and is not tested in production
(6) The hysteresis value is the difference between the RH measurement in a rising and falling RH environment, at a specific RH point
(7) Actual response times will vary dependent on system thermal mass and air-flow
(8) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity
(9) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, outgassing tapes, adhesives, packaging materials, etc.