SNAS890A February   2025  – June 2025 HDC3120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
    5. 8.5 Storage and PCB Assembly
      1. 8.5.1 Storage and Handling
      2. 8.5.2 Product Storage
      3. 8.5.3 PCB Assembly Flow
      4. 8.5.4 Rework Consideration
      5. 8.5.5 Sensitivity to Chemicals and Vapors
      6. 8.5.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.5.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.3 PCB Assembly Flow

Providing a clean, minimal-exposure assembly process protects the sensing element and preserves accuracy. When possible, place the HDC3120-Q1 sensor as one of the last components on the board to limit the number of solder reflow cycles and exposure to contaminants. Follow these guidelines for recommended soldering reflow procedures:

  • Reflow Profile: Adhere to IPC/JEDEC J-STD-020 with a peak temperature not exceeding 260°C. For general reflow guidelines, refer to: MSL Ratings and Reflow Profiles.

  • No-Clean Solder Paste: Must be used for open-cavity devices (HDC3020, HDC3120, HDC3120-Q1 or HDC3021 after tape removal) because water or solvent rinses can leave contaminants on the sensing area. Also verify that the no-clean flux does not contain volatile chemicals that can outgas.

  • Impact on Sensor Accuracy: High temperature can temporarily shift RH readings, this shift reduces over time as the sensor is exposed to typical indoor ambient conditions to absorb moisture, and typically recovered by rehydration.

  • Board wash: For boards requiring washing, cover the sensor cavity during any washing. Do not wash the open cavity sensors without a protective cover (for example, HDC3120-Q1) water or solvents. Avoid ultrasonic cleaners or vibrations that can damage the sensor.