SNAS890A February   2025  – June 2025 HDC3120-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
    5. 8.5 Storage and PCB Assembly
      1. 8.5.1 Storage and Handling
      2. 8.5.2 Product Storage
      3. 8.5.3 PCB Assembly Flow
      4. 8.5.4 Rework Consideration
      5. 8.5.5 Sensitivity to Chemicals and Vapors
      6. 8.5.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.5.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Heater Electrical Behavior

The on-chip heater of the HDC3120-Q1 operates as a resistive element with a positive temperature coefficient (PTC)—its resistance increases with temperature. The heater resistance can be estimated using Equation 6 as a function of the junction temperature (TJ):

Equation 6. RHEATER (TJ) R25-HEATER [1 + α(TJ - 25 °C)] 

At 25 °C, the typical resistance (R25-HEATER) is approximately 168.4 Ω, and the temperature coefficient α is roughly 0.00326 °C⁻¹. When HEAT_EN is asserted, the heater draws current from VDD according to Ohm’s law: IHEATER ≅ VDD / RHEATER. Note while the resistance increases linearly with temperature, the actual junction temperature—and thus heater resistance—varies depending on environmental conditions, airflow, PCB layout, and duty cycle.

With the heater resistance estimated, the heater power can then be approximated using Equation 7:

Equation 7. PHEATER TJVDD2RHEATER (TJ)VDD2R25-HEATER [1 + α(TJ - 25 °C)] 

Table 7-4 summarizes typical heater current and power values at 25 °C ambient. These values represent the initial heater power draw, prior to thermal ramp-up. Heater resistance increases as the die warms, so current draw decreases slightly over time during a heating cycle. However, during the initial 1–2 seconds, when the heater is still cool, the current draw is at the maximum.

Table 7-4 Estimated Heater Current and Power at 25 °C

Supply Voltage (VDD)

Heater Current (typ.)

Heater Power (typ.)

1.8 V

≅10 mA

≅18 mW

3.3 V

≅19 mA

≅62 mW

5.0 V

≅28 mA

≅138 mW

5.5 V (maximum)

≅30 mA

≅165 mW

Note:

Due to these varying factors, estimating exact junction temperature from resistance or power is generally not practical. Therefore, users must focus on heater enable timing and system-level thermal behavior, rather than relying on theoretical resistance models.

Always design your power supply and system thermal envelope to accommodate the peak heater current observed during startup. This verifies stability and avoids brownout conditions, especially at higher VDD levels.