SNAS890A February   2025  – June 2025 HDC3120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
    5. 8.5 Storage and PCB Assembly
      1. 8.5.1 Storage and Handling
      2. 8.5.2 Product Storage
      3. 8.5.3 PCB Assembly Flow
      4. 8.5.4 Rework Consideration
      5. 8.5.5 Sensitivity to Chemicals and Vapors
      6. 8.5.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.5.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.5 Sensitivity to Chemicals and Vapors

Humidity-sensing polymers can absorb various chemicals, leading to temporary or permanent accuracy shifts. Common contaminants include:

  • Cleaning agents (ammonia, bleach, hydrogen peroxide)

  • Adhesives, acidic or basic fumes, outgassing from packaging materials

Check relevant material safety data sheets (MSDS) for potential contaminants. Minimize damage by operating the sensor in controlled environments, limiting VOC exposure, and verifying the device is sealed or shielded from corrosive or high-concentration fumes.

Testing for specific chemicals and exposure profiles have been performed for some chemicals, for results and information on the chemicals testing done for the HDC3x humidity sensor family, refer to the HDC3x Silicon User's Guide.