SNAS890A February   2025  – June 2025 HDC3120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power-Up
      2. 7.3.2 Device Disable and Enable
      3. 7.3.3 Conversion of the Signal Output
        1. 7.3.3.1 Relative Humidity (RH%) Measurement
        2. 7.3.3.2 Temperature Measurement
      4. 7.3.4 NIST Traceability and Unique ID
      5. 7.3.5 Output Short Circuit Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 On-Chip Heater
        1. 7.4.1.1 Operating Principle
          1. 7.4.1.1.1 Heater Configuration Example
        2. 7.4.1.2 Heater Electrical Behavior
        3. 7.4.1.3 Heater Temperature Increase
        4. 7.4.1.4 Heater Usage Guidelines
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
    5. 8.5 Storage and PCB Assembly
      1. 8.5.1 Storage and Handling
      2. 8.5.2 Product Storage
      3. 8.5.3 PCB Assembly Flow
      4. 8.5.4 Rework Consideration
      5. 8.5.5 Sensitivity to Chemicals and Vapors
      6. 8.5.6 Exposure to High Temperature and High Humidity Conditions
      7. 8.5.7 Recovering Sensor Performance: Bake and Rehydration Procedure
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DEF|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DEF Package8-Pin WSONTransparent Top View
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.

RH

1

O

Provides a ratiometric analog output voltage representing relative humidity (RH%). For details, see Section 7.3.3.1.

GND

2,3,8

G

Ground/VSS. Connect all GND pins to ground for stable operation.

TEMP

4

O

Provides a ratiometric analog output voltage representing temperature. For details, see Section 7.3.3.2.
VDD5PSupply Voltage, from 1.62V to 5.50V

RESET_EN

6

I

Drives the device into reset/disable mode when pulled low for at least 1µs. The device includes a 51kΩ internal pull-up to VDD. If unused, leave the pin floating, connect the pin directly to VDD, or use an external pull-up resistor to VDD. For details, see Section 7.3.2.

HEAT_EN

7

OActivates the on-chip heater when driven high. Leaving the pin floating can cause the heater to intermittently turn-on. If on-chip heater is not used, connect to GND. For details, see Section 7.4.1.

Thermal Pad

9

G

Internally connected to GND. Depending on the system requirements, the pin can be soldered or left unsoldered. Soldering is not required for mechanical stability. Leaving the thermal pad unsoldered increases junction-to-board thermal resistance, which can help manage unwanted heat conduction between the device and the PCB. If the thermal pad is soldered, the thermal pad must be left floating or connected to GND.
(1) P=Power, G=Ground, I=Input, O=Output