SBOS848B December   2017  – October 2019 INA381

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Wide Input Common-Mode Voltage Range
      2. 7.3.2 Precise Low-Side Current Sensing
      3. 7.3.3 High Bandwidth and Slew Rate
      4. 7.3.4 Alert Output
      5. 7.3.5 Adjustable Overcurrent Threshold
      6. 7.3.6 Comparator Hysteresis
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Modes
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
  8. Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Select a Current-Sensing Resistor
        1. 8.1.1.1 Select a Current-Sensing Resistor: Example
      2. 8.1.2 Increase Comparator Hysteresis
      3. 8.1.3 Operation With Common-Mode Transients Greater Than 26 V
      4. 8.1.4 Input Filtering
    2. 8.2 Typical Applications
      1. 8.2.1 Bidirectional Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Solenoid Low-Side Current Sensing
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|10
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Applications and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.