SBOS562G August   2011  – June 2020 INA826

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      General-Purpose Instrumentation Amplifier
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Inside the INA826
      2. 8.3.2  Setting the Gain
        1. 8.3.2.1 Gain Drift
      3. 8.3.3  Offset Trimming
      4. 8.3.4  Input Common-Mode Range
      5. 8.3.5  Input Protection
      6. 8.3.6  Input Bias Current Return Path
      7. 8.3.7  Reference Terminal
      8. 8.3.8  Dynamic Performance
      9. 8.3.9  Operating Voltage
        1. 8.3.9.1 Low-Voltage Operation
      10. 8.3.10 Error Sources
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Circuit Breaker
      2. 9.3.2 Programmable Logic Controller (PLC) Input
      3. 9.3.3 Using TINA-TI SPICE-Based Analog Simulation Program With the INA826
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 CMRR vs Frequency
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

Attention to good layout practices is always recommended. Keep traces short and, when possible, use a printed circuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible. Place 0.1-μF bypass capacitors close to the supply pins. Apply these guidelines throughout the analog circuit to improve performance and provide benefits such as reducing the electromagnetic-interference (EMI) susceptibility.

The INA826EVM is intended to provide basic functional evaluation of the INA826. An image of the INA826EVM is provided in Figure 73. The INA826EVM is also available for purchase through the TI eStore.

Attention to good layout practices is always recommended. For best operational performance of the device, use good PCB layout practices, including:

  • Make sure to match both input paths to avoid converting common-mode signals into differential signals.
  • Connect a bypass capacitor of 0.1-µF between each supply pin and ground, placed close to the device as possible.
  • Route the input traces as far away from the supply or output traces as possible. This reduces parasitic coupling.
  • Place the external components as close to the device as possible.
  • Keep traces as short as possible.
  • For the DRG package: Connect the exposed thermal pad to the lowest voltage potential on the circuit that is the negative power supply (–V).