SLOS581J may   2008  – august 2023 ISO3080 , ISO3082 , ISO3086 , ISO3088

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Insulation Specifications
    6. 6.6  Safety-Related Certifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics: Driver
    9. 6.9  Electrical Characteristics: Receiver
    10. 6.10 Supply Current
    11. 6.11 Switching Characteristics: Driver
    12. 6.12 Switching Characteristics: Receiver
    13. 6.13 Insulation Characteristics Curves
    14. 6.14 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Meets or exceeds TIA/EIA RS-485 requirements
  • Signaling rates up to 20 Mbps
  • 1/8 unit load – up to 256 nodes on a bus
  • Thermal shutdown protection
  • Low bus capacitance – 16 pF (typical)
  • 50 kV/μs typical transient immunity
  • Fail-safe receiver for bus open, short, idle
  • 3.3-V inputs are 5-V tolerant
  • Bus-pin ESD protection
    • 12-kV HBM between bus pins and GND2
    • 6-kV HBM between bus pins and GND1
  • Safety-related certifications:
    • 4000-VPK basic insulation, 560 VPK VIORM per DIN EN IEC 60747-17 (VDE 0884-17)
    • 2500 VRMS isolation per UL 1577
    • 4000 VPK isolation per CSA 62368-1