SLLSEP0B July   2015  – July 2025 ISO7820

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics, 5 V
    10. 5.10 Electrical Characteristics, 3.3 V
    11. 5.11 Electrical Characteristics, 2.5 V
    12. 5.12 Power Ratings
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.13 Switching Characteristics, 5 V

VCC1 = VCC2 = 5 V ± 10% (over recommended operating conditions unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tPLH, tPHLPropagation delay timeSee Figure 6-1610.716ns
PWD(1)Pulse width distortion |tPHL – tPLH|0.64.6
tsk(o) (2)Channel-to-channel output skew time2.5ns
tsk(pp) (3)Part-to-part skew time4.5ns
trOutput signal rise timeSee Figure 6-12.43.9ns
tfOutput signal fall time2.43.9
tPHZDisable propagation delay, high-to-high impedance output for ISO7820DWW and ISO7820FDWWSee Figure 6-21220ns
tPLZDisable propagation delay, low-to-high impedance output for ISO7820DWW and ISO7820FDWW1220ns
tPZHEnable propagation delay, high impedance-to-high output for ISO7820DWW1020ns
Enable propagation delay, high impedance-to-high output for ISO7820FDWW22.5μs
tPZLEnable propagation delay, high impedance-to-low output for ISO7820DWW22.5μs
Enable propagation delay, high impedance-to-low output for ISO7820FDWW1020ns
tfsDefault output delay time from input power lossMeasured from the time VCC goes below 1.7 V. See Figure 6-30.29μs
tieTime interval error216 - 1 PRBS data at 100 Mbps1ns
(1) Also known as Pulse Skew.
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.