SLLSEP0B July   2015  – July 2025 ISO7820

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics, 5 V
    10. 5.10 Electrical Characteristics, 3.3 V
    11. 5.11 Electrical Characteristics, 2.5 V
    12. 5.12 Power Ratings
    13. 5.13 Switching Characteristics, 5 V
    14. 5.14 Switching Characteristics, 3.3 V
    15. 5.15 Switching Characteristics, 2.5 V
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (February 2016) to Revision B (July 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added Note (3) to the Section 5.1 tableGo
  • Changed Note (1) of the Section 5.3 table Go
  • Added the Section 5.5 table Go
  • Changed Insulation Specifications TableGo
  • Added 15mm(typ) creepage/clearance to Insulation Specifications tableGo
  • Changed Note (1) of Table 7-1 Go

Changes from Revision * (July 2015) to Revision A (February 2016)

  • Changed the Safety and Regulatory Approvals list of Section 1 Go
  • Changed Section 1 From: 8000VPK VIOTM and 2121VPK VIORM Reinforced. To: 8000 VPK Reinforced...Go
  • Added Section 1 "TUV Certification per EN 61010-1 and EN 60950-1" Go
  • Added package: Extra wide SOIC, DWW (16) to the Device Information table Go
  • Changed text in the first paragraph of the Description From: "certifications according to VDE, CSA, and CQC". To: "certifications according to VDE, CSA, CQC, and TUV." Go
  • Changed the Figure 3-1 Go
  • Added the DWW pinout image Go
  • Changed From: VCCX To: VCCO In IOH and IOL of the Section 5.3 table Go
  • Changed From: VCCX To: VCCI In VIH and VIL of the Section 5.3 table Go
  • Added the DWW package to the Section 5.4 Go
  • Changed Table 1, added DWW package informationGo
  • Added Note 1 to the Electrical Characteristics sections Go
  • Added "Climatic category" to Table 2 and deleted Note 1 Go
  • Changed the CSA column in Table 5-1 Go
  • Added TUV to the Section 5.7 section and Table 5-1. Deleted Note 1 in Table 4 Go
  • Changed the Supply Current section of the Section 5.9 to include the DWW package information Go
  • Deleted Note 1 From the Section 5.9 Go
  • Changed the Supply Current section of the Section 5.10 to include the DWW package information Go
  • Deleted Note 1 From the Section 5.10 Go
  • Changed the Supply Current section of the Section 5.11 to include the DWW package information Go
  • Deleted Note 1 From the Section 5.11 Go
  • Added "Channel-to-channel output skew time" to Section 5.13 Go
  • Added "Channel-to-channel output skew time" to Section 5.14 Go
  • Added "Channel-to-channel output skew time" to Section 5.15 Go
  • Changed Table 7-1 Go
  • Changed Figure 7-3 Go
  • Changed the Section 8.2 text and Figure 8-1 Go