SNVS952F December   2012  – May 2021 LM25019

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Control Overview
      2. 7.3.2  VCC Regulator
      3. 7.3.3  Regulation Comparator
      4. 7.3.4  Overvoltage Comparator
      5. 7.3.5  On-Time Generator
      6. 7.3.6  Current Limit
      7. 7.3.7  N-Channel Buck Switch and Driver
      8. 7.3.8  Synchronous Rectifier
      9. 7.3.9  Undervoltage Detector
      10. 7.3.10 Thermal Protection
      11. 7.3.11 Ripple Configuration
      12. 7.3.12 Soft Start
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 RFB1, RFB2
        2. 8.2.2.2 Frequency Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Type III Ripple Circuit
        6. 8.2.2.6 VCC and Bootstrap Capacitor
        7. 8.2.2.7 Input Capacitor
        8. 8.2.2.8 UVLO Resistors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

MIN(1)MAXUNIT
VIN, UVLO to RTN–0.353V
SW to RTN–1.5VIN + 0.3V
SW to RTN (100 ns transient)–5VIN + 0.3V
BST to VCC53V
BST to SW13V
RON to RTN–0.353V
VCC to RTN–0.313V
FB to RTN–0.35V
Lead Temperature(2)200°C
Maximum Junction Temperature(3)150°C
Storage temperature, Tstg–55150°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Section 6.3 are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see Section 6.5 . The RTN pin is the GND reference electrically connected to the substrate.
(2) For detailed information on soldering plastic SO Power PAD-8 package, refer to the Packaging Data Book available from Texas Instruments. Max solder time not to exceed 4 seconds.
(3) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.