SNVS509F April   2007  – November 2023 LM25116

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High-Voltage Start-Up Regulator
      2. 6.3.2 Enable
      3. 6.3.3 UVLO
      4. 6.3.4 Oscillator and Sync Capability
      5. 6.3.5 Error Amplifier and PWM Comparator
      6. 6.3.6 Ramp Generator
      7. 6.3.7 Current Limit
      8. 6.3.8 HO Output
      9. 6.3.9 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Soft Start and Diode Emulation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Timing Resistor
        2. 7.2.2.2  Output Inductor
        3. 7.2.2.3  Current Sense Resistor
        4. 7.2.2.4  Ramp Capacitor
        5. 7.2.2.5  Output Capacitors
        6. 7.2.2.6  Input Capacitors
        7. 7.2.2.7  VCC Capacitor
        8. 7.2.2.8  Bootstrap Capacitor
        9. 7.2.2.9  Soft Start Capacitor
        10. 7.2.2.10 Output Voltage Divider
        11. 7.2.2.11 UVLO Divider
        12. 7.2.2.12 MOSFETs
        13. 7.2.2.13 MOSFET Snubber
        14. 7.2.2.14 Error Amplifier Compensation
        15. 7.2.2.15 Comprehensive Equations
          1. 7.2.2.15.1 Current Sense Resistor and Ramp Capacitor
          2. 7.2.2.15.2 Modulator Transfer Function
          3. 7.2.2.15.3 Error Amplifier Transfer Function
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VIN to GND–0.345V
VCC, VCCX, UVLO to GND(2)–0.316V
SW, CS to GND–345V
HB to SW–0.316V
HO to SW–0.3HB + 0.3V
VOUT to GND–0.345V
CSG to GND–11V
LO to GND–0.3VCC + 0.3V
SS to GND–0.37V
FB to GND–0.37V
DEMB to GND–0.3VCCV
RT to GND–0.37V
EN to GND–0.345V
Junction temperature, TJ150°C
Storage temperature, Tstg–55150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) These pins must not exceed VIN.