SNVS180N April   2002  – April 2016 LM2750

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pre-Regulation
      2. 7.3.2 Input, Output, and Ground Connections
      3. 7.3.3 Shutdown
      4. 7.3.4 Soft Start
      5. 7.3.5 Output Current Capability
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Output Current Limiting
      8. 7.3.8 Programming the Output Voltage of the LM2750-ADJ
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Brightness/Dimming Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Ripple
    2. 8.2 Typical Applications
      1. 8.2.1 LM2750-ADJ Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitors
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Flying Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Power Efficiency And Power Dissipation
        3. 8.2.1.3 Application Curve
      2. 8.2.2 LM2750 LED Drive Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Requirements
          1. 8.2.2.2.1 LED Driver Power Efficiency
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 LED Driver Power Consumption
  10. 10Layout
    1. 10.1 Layout Recommendations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
      2. 11.2.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Recommendations

A good board layout of the LM2750 circuit is required to achieve optimal assembly, electrical, and thermal dissipation performance. Figure 18 is an example of a board layout implementing recommended techniques. For more information related to layout for the WSON/SON package, see AN-1187 Leadless Leadframe Package (LLP) (SNOA401).

General guidelines for board layout are:

  • Place capacitors as close to the LM2750 device as possible and on the same side of the board. VIN and VOUT connections are most critical: run short traces from the LM2750 pads directly to these capacitor pads.
  • Connect the ground pins of the LM2750 and the capacitors to a good ground plane. The ground plane is essential for both electrical and thermal dissipation performance.
  • For optimal thermal performance, make the ground plane(s) as large as possible. Connect the die-attach pad (DAP) of the LM2750 to the ground plane(s) with wide traces and/or multiple vias. Top-layer ground planes are most effective in increasing the thermal dissipation capability of the WSON package. Large internal ground planes are also very effective in keeping the die temperature of the LM2750 within operating ratings.

10.2 Layout Example

LM2750 LM2750-ADJ 20035126.png Figure 18. LM2750-5.0 Recommended Layout