SNVS180N April   2002  – April 2016 LM2750

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pre-Regulation
      2. 7.3.2 Input, Output, and Ground Connections
      3. 7.3.3 Shutdown
      4. 7.3.4 Soft Start
      5. 7.3.5 Output Current Capability
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Output Current Limiting
      8. 7.3.8 Programming the Output Voltage of the LM2750-ADJ
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Brightness/Dimming Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Ripple
    2. 8.2 Typical Applications
      1. 8.2.1 LM2750-ADJ Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitors
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Flying Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Power Efficiency And Power Dissipation
        3. 8.2.1.3 Application Curve
      2. 8.2.2 LM2750 LED Drive Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Requirements
          1. 8.2.2.2.1 LED Driver Power Efficiency
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 LED Driver Power Consumption
  10. 10Layout
    1. 10.1 Layout Recommendations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
      2. 11.2.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN pin: Voltage to GND –0.3 6 V
SD pin: Voltage to GND –0.3 (VIN + 0.3) V
Junction temperature, TJ-MAX-ABS 150 °C
Continuous power dissipation(3) Internally limited
Maximum output current(4) 175 mA
Maximum lead temperature (soldering, 5 seconds) 260 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.
(3) Thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and disengages at TJ = 135°C (typical).
(4) Absolute maximum output current specified by design. Recommended input voltage range for output currents in excess of 120 mA: 3.1 V to 4.4 V.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine model ±100
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
LM2750-5.0 input voltage 2.7 5.6 V
LM2750-ADJ input voltage 3.8 V ≤ VOUT ≤ 4.9 V 2.7 (VOUT + 0.7) V
4.9 V ≤ VOUT ≤ 5.2 V 2.7 5.6 V
LM2750-ADJ output voltage 3.8 5.2 V
Recommended output current 2.9 V ≤ VIN ≤ 5.6 V 0 120 mA
2.7 V ≤ VIN ≤ 2.9 V 0 40 mA
Junction temperature, TJ –40 125 °C
Ambient temperature, TA(3) –40 85 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For performance limits and associated test conditions, see Electrical Characteristics.
(2) All voltages are with respect to the potential at the GND pin.
(3) Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by this equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). For more information on these topics, see AN-1187 Leadless Leadframe Package (LLP) (SNOA401) and Power Efficiency And Power Dissipation.

6.4 Thermal Information

THERMAL METRIC(1) LM2750-5.0, LM2750-ADJ UNIT
NGY (WSON) DSC (WSON)
10 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 62.4 45.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.2 46.2 °C/W
RθJB Junction-to-board thermal resistance 36.1 21.5 °C/W
ψJT Junction-to-top characterization parameter 1.2 0.7 °C/W
ψJB Junction-to-board characterization parameter 36.2 21.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.7 6.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Typical values apply for TJ = 25°C; minimum and maximum limits apply over the operating junction temperature range;
2.9 V ≤ VIN ≤ 5.6 V, VOUT = 5 V (LM2750-ADJ), V(SD) = VIN, CFLY = 1 µF, CIN = 2 × 1 µF, COUT = 2 × 1 µF, unless otherwise specified (1)(2)(3).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOUT Output voltage
(LM2750-5.0)		 2.9 V ≤ VIN ≤ 5.6 V,
IOUT ≤ 120 mA		 4.8 (–4%) 5 5.2 (4%) V
2.7 V ≤ VIN ≤ 2.9 V,
IOUT ≤ 40 mA, TJ = 25°C		 4.8 (–4%) 5 5.2 (4%)
IQ Operating supply current IOUT = 0mA, TJ = 25°C
VIH(MIN) ≤ V(SD) ≤ VIN		 5 10 mA
IOUT = 0 mA,
VIH(MIN) ≤ V(SD) ≤ VIN		 12
ISD Shutdown supply current V(SD) = 0V 2 µA
VFB Feedback pin voltage
(LM2750-ADJ)		 VIN = 3.1 V 1.17 1.232 1.294 V
IFB Feedback pin input current (LM2750-ADJ) VFB = 1.4 V 1 nA
VR Output ripple COUT = 10 µF, IOUT = 100 mA 4 mVp-p
COUT = 2.2 µF, IOUT = 100 mA 15
EPEAK Peak efficiency
(LM2750-5.0)		 VIN = 2.7 V, IOUT = 40 mA 87%
VIN = 2.9 V, IOUT = 120 mA 85%
EAVG Average Efficiency over Li-Ion Input Range
(LM2750-5.0) (4)		 VIN = 2.9 V to 4.2 V, IOUT = 120 mA 70%
VIN = 2.9 V to 4.2 V, IOUT = 40 mA 67%
ƒSW Switching frequency 1 1.7 MHz
ILIM Current limit VOUT shorted to GND 300 mA
SHUTDOWN PIN (SD) CHARACTERISTICS
VIH Logic-high SD input 1.3 VIN V
VIL Logic-low SD input 0 0.4 V
IIH SD input current(5) 1.3 V ≤ V(SD) ≤ VIN 15 50 µA
IIL SD input current V(SD) = 0 V –1 1 µA
CAPACITOR CHARACTERISTICS
CIN Required input capacitance(6) IOUT ≤ 60 mA 1 µF
60 mA ≤ IOUT ≤ 120 mA 2
COUT Required output capacitance(6) IOUT ≤ 60 mA 1 µF
60 mA ≤ IOUT ≤ 120 mA 2
(1) All voltages are with respect to the potential at the GND pin.
(2) Minimum and maximum limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm.
(3) CFLY, CIN, and COUT : Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
(4) Efficiency is measured versus VIN, with VIN being swept in small increments from 3 V to 4.2 V. The average is calculated from these measurements results. Weighting to account for battery voltage discharge characteristics (VBAT vs. time) is not done in computing the average.
(5) SD Input Current (IIH ) is due to a 200-kΩ (typical) pulldown resistor connected internally between the SD pin and GND.
(6) Limit is the minimum required output capacitance to ensure proper operation. This electrical specification is specified by design.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON VOUT turnon time VIN = 3 V, IOUT = 100 mA(1) 0.5 ms
(1) Turnon time is measured from when SD signal is pulled high until the output voltage crosses 90% of its final value.

6.7 Typical Characteristics

Unless otherwise specified: VIN = 3.6 V, TA = 25°C, CIN = 2.2 µF, CFLY = 1 µF, COUT = 2.2 µF. Capacitors are low-ESR multi-layer ceramic capacitors (MLCCs).
LM2750 LM2750-ADJ 20035115.png
Figure 1. Output Voltage vs. Output Current
LM2750 LM2750-ADJ 20035117.png
Figure 3. Output Voltage vs. Input Voltage
LM2750 LM2750-ADJ 20035120.png
Figure 5. Quiescent Supply Current
LM2750 LM2750-ADJ 20035122.png
Figure 7. Switching Frequency
LM2750 LM2750-ADJ 20035113.png
IOUT = 120 mA
Figure 9. Output Voltage Ripple

LM2750 LM2750-ADJ 20035116.png
Figure 2. Output Voltage vs. Output Current
LM2750 LM2750-ADJ 20035119.png
Figure 4. Input Current vs. Output Current
LM2750 LM2750-ADJ 20035121.png
Figure 6. Current Limit Behavior
LM2750 LM2750-ADJ 20035112.png
Figure 8. Output Voltage Ripple
LM2750 LM2750-ADJ 20035114.png
Figure 10. Turnon Behavior