SNVS770I June   1999  – January 2015 LM2941 , LM2941C

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM2941T, LM2941S, LM2941LD
    6. 6.6 Electrical Characteristics: LM2941CT, LM2941CS
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Short-Circuit Current Limit
      2. 7.3.2 Overvoltage Shutdown (OVSD)
      3. 7.3.3 Thermal Shutdown (TSD)
      4. 7.3.4 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With ON/OFF Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor
        2. 8.2.2.2 Setting the Output Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Thermal Considerations
      1. 10.4.1 TO-263 Mounting
      2. 10.4.2 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Definition of Terms
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NDH|5
  • NGN|8
  • KTT|5
  • KC|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Definition of Terms

    Dropout VoltageThe input-voltage differential at which the circuit ceases to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100 mV from the nominal value obtained at (VOUT + 5 V) input, dropout voltage is dependent upon load current and junction temperature.
    Input-Output Differential The voltage difference between the unregulated input voltage and the regulated output voltage for which the regulator will operate.
    Input Voltage The DC voltage applied to the input terminals with respect to ground.
    Line RegulationThe change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected.
    Load RegulationThe change in output voltage for a change in load current at constant chip temperature.
    Long Term StabilityOutput voltage stability under accelerated life-test conditions after 1000 hours with maximum rated voltage and junction temperature.
    Output Noise VoltageThe rms AC voltage at the output, with constant load and no input ripple, measured over a specified frequency range.
    Quiescent CurrentThat part of the positive input current that does not contribute to the positive load current. The regulator ground lead current.
    Ripple RejectionThe ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage.
    Temperature Stability of VOUTThe percentage change in output voltage for a thermal variation from room temperature to either temperature extreme.

11.2 Documentation Support

11.2.1 Related Documentation

  • AN-1520: A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (SNVA183)
  • AN-1187: Leadless Leadframe Package (LLP) (SNOA401)
  • AN-2020: Thermal Design By Insight, Not Hindsight (SNVA419)

11.3 Related Links

Table 1 below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LM2941 Click here Click here Click here Click here Click here
LM2941C Click here Click here Click here Click here Click here

11.4 Trademarks

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.