SNVSCL9B March   2011  – December 2024 LM3481-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings: LM3481-Q1
    3. 5.3 Recommended Operating Ratings
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Overvoltage Protection
      2. 6.3.2 Bias Voltage
      3. 6.3.3 Slope Compensation Ramp
      4. 6.3.4 Frequency Adjust, Synchronization, and Shutdown
      5. 6.3.5 Undervoltage Lockout (UVLO) Pin
      6. 6.3.6 Short-Circuit Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Boost Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1  Custom Design with WEBENCH Tools
          2. 7.2.1.2.2  Power Inductor Selection
          3. 7.2.1.2.3  Programming the Output Voltage and Output Current
          4. 7.2.1.2.4  Current Limit With Additional Slope Compensation
          5. 7.2.1.2.5  Power Diode Selection
          6. 7.2.1.2.6  Power MOSFET Selection
          7. 7.2.1.2.7  Input Capacitor Selection
          8. 7.2.1.2.8  Output Capacitor Selection
          9. 7.2.1.2.9  Driver Supply Capacitor Selection
          10. 7.2.1.2.10 Compensation
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Typical SEPIC Converter
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Power MOSFET Selection
          2. 7.2.2.2.2 Power Diode Selection
          3. 7.2.2.2.3 Selection of Inductors L1 and L2
          4. 7.2.2.2.4 Sense Resistor Selection
          5. 7.2.2.2.5 SEPIC Capacitor Selection
          6. 7.2.2.2.6 Input Capacitor Selection
          7. 7.2.2.2.7 Output Capacitor Selection
        3. 7.2.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Custom Design with WEBENCH Tools
      2. 8.1.2 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) LM3481-Q1 UNIT
VSSOP
10 PINS
RθJA Junction-to-ambient thermal resistance 151.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.6
RθJB Junction-to-board thermal resistance 83.5
ψJT Junction-to-top characterization parameter 7.5
ψJB Junction-to-board characterization parameter 82.4
RθJC(bot) Junction-to-case (bottom) thermal resistance -
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.