SNVS496F January   2007  – May 2021 LM5002

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage VCC Regulator
      2. 7.3.2 Oscillator
      3. 7.3.3 External Synchronization
      4. 7.3.4 Enable and Standby
      5. 7.3.5 Error Amplifier and PWM Comparator
      6. 7.3.6 Current Amplifier and Slope Compensation
      7. 7.3.7 Power MOSFET
    4. 7.4 Device Functional Modes
      1. 7.4.1 Thermal Protection
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VIN
      2. 8.1.2 SW PIN
      3. 8.1.3 EN or UVLO Voltage Divider Selection
      4. 8.1.4 Soft Start
    2. 8.2 Typical Applications
      1. 8.2.1 Non-Isolated Flyback Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Switching Frequency
          2. 8.2.1.2.2 Flyback Transformer
          3. 8.2.1.2.3 Peak MOSFET Current
          4. 8.2.1.2.4 Output Capacitance
          5. 8.2.1.2.5 Output Diode Rating
          6. 8.2.1.2.6 Power Stage Analysis
          7. 8.2.1.2.7 Loop Compensation
      2. 8.2.2 Isolated Flyback Regulator
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Boost Regulator
        1. 8.2.3.1 Design Requirements
      4. 8.2.4 24-V SEPIC Regulator
        1. 8.2.4.1 Design Requirements
      5. 8.2.5 12-V Automotive SEPIC Regulator
        1. 8.2.5.1 Design Requirements
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Power Stage Analysis

In any switch-mode topology that has the power MOSFET between the inductor and the output capacitor (boost, buck-boost, Flyback, SEPIC, and so on) a Right Half-Plane Zero (RHPZ) is produced by the power stage in the loop transfer function during Continuous Conduction Mode (CCM). If the topology is operated in Discontinuous Conduction Mode (DCM), the RHPZ does not exist. It is a function of the duty cycle, load and inductance, and causes an increase in loop gain while reducing the loop phase margin. A common practice is to determine the worst case RHPZ frequency and set the loop unity gain frequency below one-third of the RHPZ frequency

In the Flyback topology, the equation for the RHPZ is given by Equation 14.

Equation 14. GUID-5B03B59A-E17D-4DEB-9A90-29A71F7B5489-low.gif

The worst case RHPZ frequency is at the maximum load where IOUT is the highest and at minimum input voltage where the duty cycle D is the highest. Assuming these conditions fRHPZ is 24.6 kHz.

The LM5002 uses slope compensation to ensure stability when the duty cycle exceeds 45%. This has the affect of adding some Voltage Mode control to this current-mode IC. The effect on the power stage (Plant) transfer function is calculated in the following equations:

Inductor current slope during MOSFET ON time (Equation 15)

Equation 15. GUID-113FA7AD-B8D1-4959-89BF-864A14DFE9EF-low.gif

Slope compensation ramp (Equation 16)

Equation 16. GUID-CCE6BB5A-01BE-4CBC-8F61-889C8B0F9987-low.gif

Current-mode sampling gain (Equation 17)

Equation 17. GUID-FE5E4D4F-CCDF-4FAA-BB9C-9029EBA91FFB-low.gif

The control-to-output transfer function (GVC) using low ESR ceramic capacitors is Equation 18.

Equation 18. GUID-EFB55475-1830-43F8-981A-782AF9194863-low.gif

where:

  • LSEC is the transformer inductance referenced to the secondary side and is equal to:
    Equation 19. GUID-65E1219B-9A1D-4AEF-A797-2D5AAEDE2EC8-low.gif

If high ESR capacitors (for example, aluminum electrolytic) are used for the output capacitance, an additional zero appears at frequency in Equation 20, which increases the gain slope by +20 dB per decade of frequency and boosts the phase 45° at FZERO(ESR) and 90° at 10 × FZERO(ESR).

Equation 20. GUID-8D612707-21AA-4317-B368-FC400891BDAC-low.gif

where:

  • ESR is the series resistance of the output capacitor
  • COUT is the output capacitance

With these calculations, an approximate power stage Bode plot can be constructed with Equation 21.

Equation 21. GUID-CC6EAF1F-0CAE-4A37-8AC3-3B9B04E2E573-low.gif

where:

  • [Re(GVC(f))] is the real portion of
  • [Im(GVC(f))] is the imaginary portion of
Equation 22. GUID-3715027C-9A0B-44CC-86A8-A130933F7914-low.gif

Because these equations don’t take into account the various parasitic resistances and reactances present in all power converters, there is some difference between the calculated Bode plot and the gain and phase of the actual circuit. It is therefore important to measure the converter using a network analyzer to quantify the implementation and adjust where appropriate.