SNAS558N January   2000  – March 2024 LMC555

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Power Dissipation
      2. 7.3.2 Various Packages and Compatibility
      3. 7.3.3 Operates in Both Astable and Monostable Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Monostable Operation
      2. 7.4.2 Astable Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Flash LED in Monostable Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Frequency Divider
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Application Curve
      3. 8.2.3 Pulse Width Modulator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Application Curve
      4. 8.2.4 Pulse Position Modulator
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Application Curve
      5. 8.2.5 50% Duty Cycle Oscillator
        1. 8.2.5.1 Design Requirements
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
  • YPB|8
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision M (July 2016) to Revision N (March 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated wording of Features bullets for clarityGo
  • Updated GROUND and V+ pin types in Pin Configuration and Functions Go
  • Changed VCC to V+ in Pin Configuration and Functions Go
  • Added (V+) to DISCHARGE description in Pin Configuration and Functions Go
  • Updated RθJA and added detailed thermal characteristics for all packages in Thermal Information Go
  • Moved timing accuracy, timing shift with supply, timing shift with temperature, astable frequency, maximum frequency, output rise and fall times, and trigger propagation delay parameters from Electrical Characteristics to Switching Characteristics Go
  • Changed supply current (IS) typical values from 50 µA to 130 µA at VS = 1.5 V; from 100 µA to 180 µA at VS = 1.5 V; and from 150 µA to 220 µA at VS = 12 V, in Electrical Characteristics Go
  • Changed supply current (IS) max value from 150 µA to 200 µA at VS = 1.5 V in Electrical Characteristics Go
  • Changed reset current (IRES) test condition to VRES = VS in Electrical Characteristics Go
  • Added new reset current (IRES) typical value for test condition VRES = 0 V to Electrical Characteristics Go
  • Updated Switching Characteristics to clarify that values are specified by design, characterization, or bothGo
  • Changed units of timing shift with temperature from %V to %/V (typo) in Switching Characteristics Go
  • Changed functional block diagram to simplified schematic and moved to Overview Go
  • Updated Functional Block Diagram Go
  • Changed VCC to VS in Figure 7-3Go
  • Changed values of RA from 3.9 kΩ to 1.78 kΩ, and RB and 9 kΩ to 4.12 kΩ in Figure 7-6Go
  • Changed VCC to VS in Figure 7-6Go
  • Changed "LM555" to "LMC555" (typo) in Typical Applications Go
  • Removed redundant equation and added link to monostable figure in Design Requirements Go
  • Changed instances of "LM555" to "LMC555" to fix typos in Typical Application and Power Supply Recommendations Go
  • Changed "LM555" to "LMC555" (typo) in Power Supply Recommendations Go
  • Updated figure in Layout Example Go

Changes from Revision L (February 2016) to Revision M (July 2016)

  • Changed order of Features Go
  • Changed stable to astable (typo)Go
  • Changed stable to astable - typo. Go
  • Changed beings to begins typo.Go
  • Changed typo LM555 to LMC555. Go
  • Changed typo LM555 to LMC555. Go
  • Added additional applications. Go

Changes from Revision K (January 2015) to Revision L (February 2016)

  • Changed typo - temp range from 185 to 85 Go

Changes from Revision J (March 2013) to Revision K (October 2014)

  • Added Pin Configuration and Functions, ESD Ratings, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections Go

Changes from Revision I (March 2013) to Revision J (March 2013)

  • Changed layout of National Semiconductor Data Sheet to TI format Go