SNAS558M February   2000  – July 2016 LMC555

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low-Power Dissipation
      2. 8.3.2 Various Packages and Compatibility
      3. 8.3.3 Operates in Both Astable and Monostable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Monostable Operation
      2. 8.4.2 Astable Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Frequency Divider
      1. 9.3.1 Design Requirements
      2. 9.3.2 Application Curve
    4. 9.4 Pulse Width Modulator
      1. 9.4.1 Design Requirements
      2. 9.4.2 Application Curve
    5. 9.5 Pulse Position Modulator
      1. 9.5.1 Design Requirements
      2. 9.5.2 Application Curve
    6. 9.6 50% Duty Cycle Oscillator
      1. 9.6.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation SupportChanged layout of National Semiconductor Data Sheet to TI format
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from L Revision (February 2016) to M Revision

  • Changed order of Features list. Go
  • Changed stable to astable - typo. Go
  • Changed stable to astable - typo. Go
  • Changed beings to begins typo.Go
  • Changed typo LM555 to LMC555. Go
  • Changed typo LM555 to LMC555. Go
  • Added additional applications. Go

Changes from K Revision (January 2015) to L Revision

  • Changed typo - temp range from 185 to 85 Go

Changes from J Revision (March 2013) to K Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from I Revision (March 2013) to J Revision

  • Changed layout of National Semiconductor Data Sheet to TI format Go