SNOS611F July   1999  – March 2025 LMC6041 , LMC6042 , LMC6044

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: LMC6041
    5. 5.5 Thermal Information: LMC6042
    6. 5.6 Thermal Information: LMC6044
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating For Input Capacitance
      3. 6.1.3 Capacitive-Load Tolerance
    2. 6.2 Typical Applications
      1. 6.2.1 Instrumentation Amplifiers
      2. 6.2.2 Low-Leakage Sample and Hold
      3. 6.2.3 Square-Wave Generator
      4. 6.2.4 AC Coupled Power Amplifier
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed-Circuit-Board Layout for High-Impedance Work
      2. 6.3.2 Layout Examples
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3.     Trademarks
    4. 7.3 Electrostatic Discharge Caution
    5. 7.4 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.