SNLS568D March   2017  – May 2020 LMH1228

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Timing Specifications
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Pins and Thresholds
      2. 7.3.2 OUT0_SEL and SDI_OUT2_SEL Control
      3. 7.3.3 Input Signal Detect
      4. 7.3.4 Continuous Time Linear Equalizer (CTLE)
      5. 7.3.5 Clock and Data (CDR) Recovery
      6. 7.3.6 Internal Eye Opening Monitor (EOM)
      7. 7.3.7 Output Function Control
      8. 7.3.8 Output Driver Control
        1. 7.3.8.1 Line-Side Output Cable Driver (SDI_OUT1+, SDI_OUT2+)
          1. 7.3.8.1.1 Output Amplitude (VOD)
          2. 7.3.8.1.2 Output Pre-Emphasis
          3. 7.3.8.1.3 Output Slew Rate
          4. 7.3.8.1.4 Output Polarity Inversion
        2. 7.3.8.2 Host-Side 100-Ω Output Driver (OUT0±)
      9. 7.3.9 Status Indicators and Interrupts
        1. 7.3.9.1 LOCK_N (Lock Indicator)
        2. 7.3.9.2 SD_N (Signal Detect)
        3. 7.3.9.3 INT_N (Interrupt)
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transaction
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
        2. 7.4.2.2 SPI Write Transaction Format
        3. 7.4.2.3 SPI Read Transaction Format
        4. 7.4.2.4 SPI Daisy Chain
    5. 7.5 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SMPTE Requirements and Specifications
      2. 8.1.2 Low-Power Optimization
      3. 8.1.3 Optimized Loop Bandwidth Settings for Arria 10 FPGA Applications
    2. 8.2 Typical Applications
      1. 8.2.1 Dual Cable Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Distribution Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Stack-Up and Ground References
      2. 10.1.2 High-Speed PCB Trace Routing and Coupling
        1. 10.1.2.1 SDI_OUT1± and SDI_OUT2±:
        2. 10.1.2.2 IN0± and OUT0±:
      3. 10.1.3 Anti-Pads
      4. 10.1.4 BNC Connector Layout and Routing
      5. 10.1.5 Power Supply and Ground Connections
      6. 10.1.6 Footprint Recommendations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Export Control Notice
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

The LMH1228 performance on SDI_OUT1+ and SDI_OUT2+ was measured with the test setups shown in Figure 22 and Figure 23.

LMH1228 app_test_setup_diagram_SDI_OUT1.gifFigure 22. Test Setup for LMH1228 to SDI_OUT1+
LMH1228 app_test_setup_diagram_SDIOUT2.gifFigure 23. Test Setup for LMH1228 to SDI_OUT2+

The eye diagrams in this subsection show how the LMH1228 improves overall signal integrity in the data path for 100-Ω differential FR4 PCB trace at IN0±.

LMH1228 CD_IO_11.88_PRBS10_200mV_14ps.png
Measured at SDI_OUT1+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 24. 11.88 Gbps, TL = 20" FR4, Reclocked
LMH1228 CD_IO_5.94G_PRBS10_200mV_28ps.png
Measured at SDI_OUT1+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 26. 5.94 Gbps, TL = 20" FR4, Reclocked
LMH1228 CD_IO_2.97G_PRBS10_200mV_56ps.png
Measured at SDI_OUT1+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 28. 2.97 Gbps, TL = 20" FR4, Reclocked
LMH1228 CD_IO_1.485G_PRBS10_200mV_112ps.png
Measured at SDI_OUT1+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 30. 1.485 Gbps, TL = 20" FR4, Reclocked
LMH1228 CD_IO_270M_PRBS10_200mV_617ps.png
Measured at SDI_OUT1+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 32. 270 Mbps, TL = 20" FR4, Reclocked
LMH1228 LMH12x8_CD_SDIOUT_1inFR4_11.88_PRBS10_200mV_14ps.png
Measured at SDI_OUT2+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 25. 11.88 Gbps, TL = 20" FR4, Reclocked
LMH1228 LMH12x8_CD_SDIOUT_1inFR4_5.94_PRBS10_200mV_28ps.png
Measured at SDI_OUT2+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 27. 5.94 Gbps, TL = 20" FR4, Reclocked
LMH1228 CD_SDIOUT_2.97G_PRBS10_200mV_56ps.png
Measured at SDI_OUT2+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 29. 2.97 Gbps, TL = 20" FR4, Reclocked
LMH1228 CD_SDIOUT_1.485G_PRBS10_200mV_112ps.png
Measured at SDI_OUT2+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 31. 1.485 Gbps, TL = 20" FR4, Reclocked
LMH1228 CD_SDIOUT_270M_PRBS10_200mV_617ps.png
Measured at SDI_OUT2+
HOST_EQ0 = F, SDI_OUT2_SEL = L, OUT_CTRL = F
Figure 33. 270 Mbps, TL = 20" FR4, Reclocked