SBOS695A August   2014  – December 2014 LMH3401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = 5 V
    6. 7.6 Electrical Characteristics: VS = 3.3 V
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  Output Reference Points
    2. 8.2  ATE Testing and DC Measurements
    3. 8.3  Frequency Response
    4. 8.4  S-Parameters
    5. 8.5  Frequency Response with Capacitive Load
    6. 8.6  Distortion
    7. 8.7  Noise Figure
    8. 8.8  Pulse Response, Slew Rate, Overdrive Recovery
    9. 8.9  Power Down
    10. 8.10 VCM Frequency Response
    11. 8.11 Test Schematics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully-Differential Amplifier
      2. 9.3.2 Single-Ended to Differential Signals
        1. 9.3.2.1 Resistor Design Equations for Single-to-Differential Applications
        2. 9.3.2.2 Input Impedance Calculations
      3. 9.3.3 Differential to Differential Signals
      4. 9.3.4 Output Common-Mode Voltage
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation with a Split Supply
      2. 9.4.2 Operation with a Single Supply
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input and Output Headroom Considerations
      2. 10.1.2 Noise Analysis
      3. 10.1.3 Thermal Considerations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Driving Matched Loads
        2. 10.2.2.2 Driving Capacitive Loads
        3. 10.2.2.3 Driving ADCs
          1. 10.2.2.3.1 SNR Considerations
          2. 10.2.2.3.2 SFDR Considerations
          3. 10.2.2.3.3 ADC Input Common-Mode Voltage Considerations—AC-Coupled Input
          4. 10.2.2.3.4 ADC Input Common-Mode Voltage Considerations—DC-Coupled Input
        4. 10.2.2.4 GSPS ADC Driver
        5. 10.2.2.5 Common-Mode Voltage Correction
        6. 10.2.2.6 Active Balun
        7. 10.2.2.7 Application Curves
    3. 10.3 Do's and Don'ts
      1. 10.3.1 Do:
      2. 10.3.2 Don't:
  11. 11Power-Supply Recommendations
    1. 11.1 Supply Voltage
    2. 11.2 Single Supply
    3. 11.3 Split Supply
    4. 11.4 Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Device Nomenclature
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.