SNAS577G February   2012  – August 2018 LMK00304

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
      2.      LVPECL Output Swing (VOD) vs. Frequency
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VCC and VCCO Power Supplies
      2. 8.3.2 Clock Inputs
      3. 8.3.3 Clock Outputs
        1. 8.3.3.1 Reference Output
  9. 9 Application and Implementation
    1. 9.1 Driving the Clock Inputs
    2. 9.2 Crystal Interface
    3. 9.3 Termination and Use of Clock Drivers
      1. 9.3.1 Termination for DC-Coupled Differential Operation
      2. 9.3.2 Termination for AC-Coupled Differential Operation
      3. 9.3.3 Termination for Single-Ended Operation
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing
    2. 10.2 Current Consumption and Power Dissipation Calculations
      1. 10.2.1 Power Dissipation Example: Worst-Case Dissipation
    3. 10.3 Power Supply Bypassing
      1. 10.3.1 Power Supply Ripple Rejection
    4. 10.4 Thermal Management
      1. 10.4.1 Support for PCB Temperature up to 105°C
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.3 Clock Outputs

The differential output buffer type for both Bank A and B outputs are configured using the CLKout_TYPE[1:0] as shown in Table 4. For applications where all differential outputs are not needed, any unused output pin should be left floating with a minimum copper length (see note below) to minimize capacitance and potential coupling and reduce power consumption. If all differential outputs are not used, it is recommended to disable (Hi-Z) the banks to reduce power. Refer to Termination and Use of Clock Drivers for more information on output interface and termination techniques.

NOTE

For best soldering practices, the minimum trace length for any unused pin should extend to include the pin solder mask. This way during reflow, the solder has the same copper area as connected pins. This allows for good, uniform fillet solder joints helping to keep the IC level during reflow.

Table 4. Differential Output Buffer Type Selection

CLKout_
TYPE1		 CLKout_
TYPE0		 CLKoutX BUFFER TYPE
(BANK A and B)
0 0 LVPECL
0 1 LVDS
1 0 HCSL
1 1 Disabled (Hi-Z)