SNAS784B March   2019  – August 2019 LMK00804B-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. Table 1. Absolute Maximum Ratings
    2. Table 2. ESD Ratings
    3. Table 3. Recommended Operating Conditions
    4. Table 4. Thermal Information
    5. Table 5. Power Supply Characteristics
    6. Table 6. LVCMOS / LVTTL DC Electrical Characteristics
    7. Table 7. Differential Input DC Electrical Characteristics
    8. Table 8. Switching Characteristics
    9. Table 9. Pin Characteristics
    10. 6.1      Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Enable Timing
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Output Clock Interface Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
          1. 9.2.1.3.1 System-Level Phase Noise and Additive Jitter Measurement
      2. 9.2.2 Input Detail
      3. 9.2.3 Input Clock Interface Circuits
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Power Dissipation Calculations
      2. 9.3.2 Thermal Management
      3. 9.3.3 Recommendations for Unused Input and Output Pins
      4. 9.3.4 Input Slew Rate Considerations
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Considerations
      1. 10.1.1 Power-Supply Filtering
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground Planes
      2. 11.1.2 Power Supply Pins
      3. 11.1.3 Differential Input Termination
      4. 11.1.4 LVCMOS Input Termination
      5. 11.1.5 Output Termination
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.3 Input Clock Interface Circuits

LMK00804B-Q1 LVCMOS_CLK_Input_Config.gifFigure 13. LVCMOS_CLK Input Configuration
LMK00804B-Q1 Single_Ended_Input_DC_Revised_SNAS784.gif
1. The Thevenin/split termination values (R = 100 Ω) at the CLK_P input may be adjusted to provide a small differential offset voltage (50 mV, for example) between the CLK_P and CLK_N inputs to prevent input chatter if the LVCMOS driver in a tri-state condition. For example, the engineer can use 105 Ω 1% to the 3.3-V rail and 97.6 Ω 1% to GND to receive a –60-mV offset voltage (VCLK_N – VCLK_P) . Ensure a logic low state if the LVCMOS driver enters a tri-state condition.
Figure 14. Single-Ended/LVCMOS Input DC Configuration