SNAS784B March   2019  – August 2019 LMK00804B-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. Table 1. Absolute Maximum Ratings
    2. Table 2. ESD Ratings
    3. Table 3. Recommended Operating Conditions
    4. Table 4. Thermal Information
    5. Table 5. Power Supply Characteristics
    6. Table 6. LVCMOS / LVTTL DC Electrical Characteristics
    7. Table 7. Differential Input DC Electrical Characteristics
    8. Table 8. Switching Characteristics
    9. Table 9. Pin Characteristics
    10. 6.1      Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Enable Timing
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Output Clock Interface Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
          1. 9.2.1.3.1 System-Level Phase Noise and Additive Jitter Measurement
      2. 9.2.2 Input Detail
      3. 9.2.3 Input Clock Interface Circuits
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Power Dissipation Calculations
      2. 9.3.2 Thermal Management
      3. 9.3.3 Recommendations for Unused Input and Output Pins
      4. 9.3.4 Input Slew Rate Considerations
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Considerations
      1. 10.1.1 Power-Supply Filtering
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground Planes
      2. 11.1.2 Power Supply Pins
      3. 11.1.3 Differential Input Termination
      4. 11.1.4 LVCMOS Input Termination
      5. 11.1.5 Output Termination
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table 3. Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply input voltage 3.135 3.3 3.465 V
VDDO Supply output voltage 3.135 3.3 3.465 V
2.375 2.5 2.625
1.71 1.8 1.89
1.425 1.5 1.575
TA Ambient temperature –40 125 °C
TJ Junction temperature –40 135 °C
fOUT Maximum output frequency(1) 350 MHz
(1) There is no minimum input / output frequency provided the input slew rate is sufficiently fast. Refer to Input Slew Rate Considerations.