SNAS822B september   2021  – june 2023 LMK1D2102 , LMK1D2104

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fail-Safe Inputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 LVDS Output Termination
      2. 9.4.2 Input Termination
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) LMK1D2102 LMK1D2104 UNIT
VQFN VQFN
16 PINS 28 PINS
RθJA Junction-to-ambient thermal resistance  48.7 38.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.4 32.1 °C/W
RθJB Junction-to-board thermal resistance 23.6 18.7 °C/W
ΨJT Junction-to-top characterization parameter 1.6 1 °C/W
ΨJB Junction-to-board characterization parameter 23.6 18.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 8.6 8.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.