SNVS737F October   2011  – June 2019 LMR24220

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  CoT Control Circuit Overview
      2. 7.3.2  Start-up Regulator (VCC)
      3. 7.3.3  Regulation Comparator
      4. 7.3.4  Zero Coil Current Detect
      5. 7.3.5  Overvoltage Comparator
      6. 7.3.6  On-Time Timer, Shutdown
      7. 7.3.7  Current Limit
      8. 7.3.8  N-Channel MOSFET and Driver
      9. 7.3.9  Soft Start
      10. 7.3.10 Thermal Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 External Components
      2. 8.2.2 Application Curve
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Package Considerations
    3. 9.3 Thermal Derating
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.