SNVSAN3F August   2017  – November 2020 LMR33630

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On-Time
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Choosing the Switching Frequency
        3. 9.2.2.3  Setting the Output Voltage
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Input Capacitor Selection
        7. 9.2.2.7  CBOOT
        8. 9.2.2.8  VCC
        9. 9.2.2.9  CFF Selection
        10. 9.2.2.10 External UVLO
        11. 9.2.2.11 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  11.   Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  14. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RNX|12
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Tape and Reel Information

LMR33630
Device Package
Type
Package Drawing Pins SPQ Reel
Diameter (mm)
Reel
Width W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LMR33630ADDAR SO PowerPAD DDA 8 2500 330 12.4 6.4 5.2 2.1 8 12 Q1
LMR33630BDDAR SO PowerPAD DDA 8 2500 330 12.4 6.4 5.2 2.1 8 12 Q1
LMR33630CDDAR SO PowerPAD DDA 8 2500 330 12.4 6.4 5.2 2.1 8 12 Q1
LMR33630
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMR33630ADDA SO PowerPAD DDA 8 75 521 194 37
LMR33630ADDAR SO PowerPAD DDA 8 2500 353 353 36
LMR33630BDDA SO PowerPAD DDA 8 75 521 194 37
LMR33630BDDAR SO PowerPAD DDA 8 2500 353 353 36
LMR33630CDDA SO PowerPAD DDA 8 75 521 194 37
LMR33630CDDAR SO PowerPAD DDA 8 2500 353 353 36