SNVSAN3F August   2017  – November 2020 LMR33630


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On-Time
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1.  Custom Design With WEBENCH® Tools
        2.  Choosing the Switching Frequency
        3.  Setting the Output Voltage
        4.  Inductor Selection
        5.  Output Capacitor Selection
        6.  Input Capacitor Selection
        7.  CBOOT
        8.  VCC
        9.  CFF Selection
        10. External UVLO
        11. Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RNX|12
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Current Limit and Short Circuit

The LMR33630 incorporates both peak and valley inductor current limit to provide protection to the device from overloads and short circuits and limit the maximum output current. Valley current limit prevents inductor current runaway during short circuits on the output, while both peak and valley limits work together to limit the maximum output current of the converter. Cycle-by-cycle current limit is used for overloads, while hiccup mode is used for sustained short circuits. Finally, a zero current detector is used on the low-side power MOSFET to implement DEM at light loads (see the Glossary). The typical value of this current limit is found under IZC in Section 7.5.

When the device is overloaded, the valley of the inductor current may not reach below ILIMIT (see Section 7.5) before the next clock cycle. When this occurs, the valley current limit control skips that cycle, causing the switching frequency to drop. Further overload causes the switching frequency to continue to drop, and the inductor ripple current to increase. When the peak of the inductor current reaches the high-side current limit, ISC (see Section 7.5), the switch duty cycle is reduced and the output voltage falls out of regulation. This represents the maximum output current from the converter and is given approximately by Equation 1.

Equation 1. GUID-16FE7ABC-A940-4C22-8155-C075F03046A5-low.gif

If, during current limit, the voltage on the FB input falls below about 0.4 V due to a short circuit, the device enters into hiccup mode. In this mode, the device stops switching for tHC (see Section 7.7), or about 94 ms and then goes through a normal re-start with soft start. If the short-circuit condition remains, the device runs in current limit for about 20 ms (typical) and then shuts down again. This cycle repeats, as shown in Figure 8-5 as long as the short-circuit-condition persists. This mode of operation helps reduce the temperature rise of the device during a hard short on the output. The output current is greatly reduced during hiccup mode. Once the output short is removed and the hiccup delay is passed, the output voltage recovers normally as shown in Figure 8-6.

GUID-9B436FED-486B-410C-8498-46FB696DE0BA-low.gifFigure 8-5 Inductor Current Burst in Short-Circuit Mode
GUID-6A1DCB30-7210-4CE7-8389-FC4E06681409-low.gifFigure 8-6 Short-Circuit Transient and Recovery