SNVSBB6C December   2019  – January 2026 LMR36506

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD (Commercial) Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 System Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable, Start-Up, and Shutdown
      2. 7.3.2  Adjustable Switching Frequency (with RT)
      3. 7.3.3  Power-Good Output Operation
      4. 7.3.4  Internal LDO, VCC UVLO, and VOUT/BIAS Input
      5. 7.3.5  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Terminal)
      6. 7.3.6  Output Voltage Selection
      7. 7.3.7  Soft Start and Recovery from Dropout
        1. 7.3.7.1 Recovery from Dropout
      8. 7.3.8  Current Limit and Short Circuit
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Input Supply Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 Auto Mode - Light Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode - Light Load Operation
        4. 7.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 FB for Adjustable Output
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 CBOOT
        7. 8.2.2.7 VCC
        8. 8.2.2.8 CFF Selection
          1. 8.2.2.8.1 External UVLO
        9. 8.2.2.9 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RPE|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (December 2022) to Revision C (January 2026)

  • Changed HotRod™ package with wettable flanks to HotRod™ QFN package in the Features sectionGo
  • Changed QFN package with wettable flanks to QFN package in the Overview sectionGo

Changes from Revision A (December 2020) to Revision B (December 2022)