SNVS251J May   2004  – September 2014 LP3990

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output Capacitor, Recommended Specifications
    7. 6.7 Timing Requirements
    8. 6.8 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Thermal Overload Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 No-Load Stability
        6. 8.2.2.6 Capacitor Characteristics
        7. 8.2.2.7 Enable Control
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 DSBGA Mounting
    4. 10.4 DSBGA Light Sensitivity
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)(3)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage –0.3 6.5 V
Output voltage –0.3 Note(4)
ENABLE input voltage –0.3 6.5
Continuous power dissipation internally limited Note(5)
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) All voltages are with respect to the potential at the GND pin.
(4) The lower of VIN + 0.3 V or 6.5 V.
(5) Internal thermal shutdown circuitry protects the device from permanent damage.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins 250 1500
Machine model –200 200
(1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Input voltage, VIN 2 6 V
Enable input voltage, VEN 0.0 VIN
Junction temperature, TJ(1) –40 125 °C
(1) TJ(max) = (TA(max) + (RθJA × PD(max)) )

6.4 Thermal Information

THERMAL METRIC(1) LP3990 UNIT
YZR (DSBGA) DBV (SOT-23) NGG (WSON)
4 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 188.9 165.2 53.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.0 69.9 51.2
RθJB Junction-to-board thermal resistance 105.3 27.3 28.2
ψJT Junction-to-top characterization parameter 0.7 1.8 0.6
ψJB Junction-to-board characterization parameter 105.2 26.8 28.3
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 8.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics(1)(3)

Unless otherwise noted, VEN = 950 mV, VIN = VOUT + 1 V or VIN = 2 V, whichever is higher. CIN = 1 µF, IOUT = 1 mA, COUT = 0.47 µF.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage Note (2), TJ = 25°C 2 6 V
ΔVOUT Output voltage tolerance ILOAD = 1 mA
TJ = 25°C		 DSBGA –1 1%
WQFN –1.5% 1.5%
SOT-23 –1.5% 1.5%
Over full line and load regulation DSBGA –2.5% 2.5%
WQFN –3% 3%
SOT-23 –4% 4%
Line regulation error VIN = (VOUT(NOM) + 1 V) to 6 V 0.1 0.02 0.1 %/V
Load regulation error IOUT = 1 mA
to 150 mA		 VOUT = 0.8 V to 1.95 V
DSBGA		 –0.005 0.002 0.005 %/mA
VOUT = 0.8 V to 1.95 V
WQFN, SOT-23		 –0.008 0.003 0.008
VOUT = 2 V to 3.3 V
DSBGA		 –0.002 0.0005 0.002
VOUT = 2 V to 3.3 V
WQFN, SOT-23		 –0.005 0.002 0.005
VDO Dropout voltage IOUT = 150 mA(4)(5) 120 200 mV
ILOAD Load current Note (5)(6), TJ = 25°C 0 µA
IQ Quiescent current VEN = 950 mV, IOUT = 0 mA 43 80 µA
VEN = 950 mV, IOUT = 150 mA 65 120
VEN = 0.4 V (output disabled), TJ = 25°C 0.002 0.2
ISC Short circuit current limit Note (7) 550 1000 mA
IOUT Maximum output current 150
PSRR Power Supply Rejection Ratio ƒ = 1 kHz, IOUT = 1 mA to 150 mA 55 dB
ƒ = 10 kHz, IOUT = 150 mA 35
eη Output noise voltage(5) BW = 10 Hz to 100 kHz VOUT = 0.8 V 60 µVRMS
VOUT = 1.5 V 125
VOUT = 3.3 V 180
TSHUTDOWN Thermal shutdown junction temperature Junction temperature (TJ) rising until the output is disabled 155 °C
Hysteresis 15
ENABLE CONTROL CHARACTERISTICS
IEN(8) Maximum input current at EN pin VEN = 0 V (Output is disabled)
TJ = 25°C		 0.001 0.1 µA
VEN = 6 V 2.5 6 10
VIL Low input threshold VIN = 2 V to 6 V
VEN falling from ≥ VIH until the output is disabled		 0.4 V
VIH High input threshold VIN = 2 V to 6 V
VEN rising from ≤ VIL until the output is enabled		 0.95
(1) All voltages are with respect to the device GND terminal, unless otherwise stated.
(2) VIN(MIN) = VOUT(NOM) + 0.5 V, or 2 V, whichever is higher.
(3) Minimum and Maximum limits are ensured through test, design, or statistical correlation over the operating junction temperature range (TJ) of –40°C to 125°C, unless otherwise stated. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
(4) Dropout voltage is voltage difference between input and output at which the output voltage drops to 100 mV below its nominal value. This parameter applies only for output voltages above 2 V.
(5) This electrical specification is verified by design.
(6) The device maintains the regulated output voltage without the load.
(7) Short-circuit current is measured with VOUT pulled to 0 V and VIN worst case = 6 V.
(8) ENABLE Pin has 1-MΩ (typical) resistor connected to GND.

6.6 Output Capacitor, Recommended Specifications(1)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
COUT Output capacitance Capacitance(3) 0.7(2) 1 500 µF
ESR 5 mΩ
(1) Unless otherwise specified, values and limits apply for TJ = 25°C.
(2) Limit applies over the full operating junction temperature range (TJ) of −40°C to 125°C.
(3) The full operating conditions for the application should be considered when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. (See Detailed Design Procedure.)

6.7 Timing Requirements

MIN NOM(1) MAX(2) UNIT
TON Turnon time (3) From VEN ↑ VIH to VOUT 95% level
(VIN(MIN) to 6 V) 		VOUT = 0.8 V 80 150 µs
VOUT = 1.5 V 105 200
VOUT = 3.3 V 175 250
Transient response Line transient response (ΔVOUT) Trise = Tfall = 30 µs(3),
ΔVIN = 600 mV		 8 16 mV (pk-pk)
Load transient response (ΔVOUT) Trise = Tfall = 1 µs(3),
IOUT = 1 mA to 150 mA
COUT = 1 µF		 55 100 mV
(1) Nom values apply for TJ = 25°C.
(2) Maximum limits apply over the full operating junction temperature (TJ) range of −40°C to 125°C.
(3) This electrical specification is verified by design.

6.8 Typical Performance Characteristics

Unless otherwise specified, CIN = 1 µF ceramic, COUT = 0.47 µF ceramic, VIN = VOUT(NOM) + 1 V, TA = 25°C, VOUT(NOM) = 1.5 V; VEN = VIN.
20076810.gif
Figure 1. Output Voltage Change vs Temperature
20076812.gif
ILOAD = 0 mA
Figure 3. Ground Current vs VIN
20076814.gif
ILOAD = 150 mA
Figure 5. Ground Current vs VIN
20076816.gif
Figure 7. Short Circuit Current
20076819.gif
Figure 9. Power Supply Rejection Ratio
20076821.gif
Figure 11. Enable Start-Up Time
20076831.gif
Figure 2. Ground Current vs Load Current
20076813.gif
ILOAD = 1 mA
Figure 4. Ground Current vs VIN
20076815.gif
Figure 6. Short Circuit Current
20076817.gif
Figure 8. Line Transient
20076820.gif
Figure 10. Power Supply Rejection Ratio
20076828.gif
Figure 12. Noise Density