SLVSEM4B June   2018  – April 2021 LSF0204-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.8 V)
    7. 6.7  Switching Characteristics: AC Performance (Translating Down, 3.3 V to 1.2 V)
    8. 6.8  Switching Characteristics: AC Performance (Translating Up, 1.8 V to 3.3 V)
    9. 6.9  Switching Characteristics: AC Performance (Translating Up, 1.2 V to 1.8 V)
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Auto-Bidirectional Voltage Translation Without DIR Pin Terminal
      2. 7.3.2 Support Multiple High Speed Translation Interfaces
      3. 7.3.3 5-V Tolerance on IO Port and 125°C Support
      4. 7.3.4 Channel Specific Translation
      5. 7.3.5 Ioff, Partial Power Down Mode
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 I2C, PMBus, SMBus, GPIO Application
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Enable, Disable, and Reference Voltage Guidelines
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Bidirectional Translation
            1. 8.2.1.2.1.1 Pull-Up Resistor Sizing
        3. 8.2.1.3 Application Curve
      2. 8.2.2 MDIO Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Multiple Voltage Translation in Single Device, Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT
Input voltage, VI (2)–0.57V
Input and output voltage, VI/O (2)–0.57V
Continuous channel current128mA
Input clamp current, IIKVI < 0–50mA
Junction temperature, TJ150°C
Storage temperature, Tstg–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and input/output negative-voltage ratings may be exceeded if the input and input/output clamp-current ratings are observed.