SLASF12D February   2023  – October 2025 MSPM0G3105 , MSPM0G3106 , MSPM0G3107

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Ramp
      1. 7.6.1 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
    13. 7.13 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 GPAMP
      1. 7.16.1 Electrical Characteristics
      2. 7.16.2 Switching Characteristics
    17. 7.17 I2C
      1. 7.17.1 I2C Timing Diagram
      2. 7.17.2 I2C Characteristics
      3. 7.17.3 I2C Filter
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 TRNG
      1. 7.21.1 TRNG Electrical Characteristics
      2. 7.21.2 TRNG Switching Characteristics
    22. 7.22 Emulation and Debug
      1. 7.22.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G310x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 GPAMP
    16. 8.16 TRNG
    17. 8.17 AES
    18. 8.18 CRC
    19. 8.19 UART
    20. 8.20 I2C
    21. 8.21 SPI
    22. 8.22 CAN-FD
    23. 8.23 WWDT
    24. 8.24 RTC
    25. 8.25 Timers (TIMx)
    26. 8.26 Device Analog Connections
    27. 8.27 Input/Output Diagrams
    28. 8.28 Serial Wire Debug Interface
    29. 8.29 Bootstrap Loader (BSL)
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Functionality by Operating Mode (MSPM0G310x)

Supported functionality in each operating mode is given in Table 8-1.

Functional key:

  • EN: The function is enabled in the specified mode.
  • DIS: The function is disabled (either clock or power gated) in the specified mode, but the function's configuration is retained.
  • OPT: The function is optional in the specified mode, and remains enabled if configured to be enabled.
  • NS: The function is not automatically disabled in the specified mode, but use of the function is not supported.
  • OFF: The function is fully powered off in the specified mode, and no configuration information is retained. When waking up from an OFF state, all module registers must be re-configured to the desired settings by application software.
Table 8-1 Supported Functionality by Operating Mode
OPERATING MODE RUN SLEEP STOP STANDBY SHUTDOWN
RUN0 RUN1 RUN2 SLEEP0 SLEEP1 SLEEP2 STOP0 STOP1 STOP2 STANDBY0 STANDBY1
Oscillators SYSOSC EN DIS EN DIS OPT(1) EN DIS DIS OFF
LFOSC or LFXT EN (LFOSC or LFXT) OFF
HFXT OPT DIS OPT DIS DIS DIS OFF
SYSPLL OPT DIS(4) OPT DIS(4) DIS(4) DIS(4) OFF
Clocks CPUCLK 80MHz 32KHz DIS OFF
MCLK to PD1 80MHz 32KHz 80MHz 32KHz DIS OFF
ULPCLK to PD0 40MHz 32KHz 40MHz 32KHz 4MHz(1) 4MHz 32KHz 32KHz DIS OFF
ULPCLK to TIMG0/8 40MHz 32KHz 40MHz 32KHz 4MHz(1) 4MHz 32KHz 32KHz 32KHz(2) OFF
RTCCLK 32KHz OFF
MFCLK OPT DIS OPT DIS OPT DIS DIS OFF
MFPCLK OPT DIS OPT DIS OPT DIS DIS OFF
LFCLK to PD0/1 32KHz DIS OFF
LFCLK to TIMG0/8 32KHz 32KHz(2) OFF
LFCLK Monitor OPT OFF
MCLK Monitor OPT DIS OFF
PMU POR monitor EN
BOR monitor EN OFF
Core regulator FULL DRIVE REDUCED DRIVE LOW DRIVE OFF
Core Functions CPU EN DIS OFF
DMA OPT DIS (triggers supported) OFF
Flash EN DIS OFF
SRAM EN DIS OFF
PD1 Peripherals UART3 OPT

DIS

OFF
SPI0/1 OPT

DIS

OFF
MCAN0 OPT OFF OPT OFF OFF OFF
TIMA0/1 OPT OFF OFF
TIMG6/7/12 OPT OFF OFF
AES OPT OFF OFF
CRC OPT DIS OFF
TRNG OPT OFF OFF
PD0 Peripherals GPIOA/B(3) OPT OPT(2) OFF
UART0/1/2 OPT OPT(2) OFF
I2C0/1 OPT OPT(2) OFF
TIMG0/8 OPT OPT(2) OFF
WWDT0/1 OPT DIS OFF
RTC OPT OFF
Analog VREF OPT OFF
ADC0/1(3) OPT NS (triggers supported) OFF
GPAMP OPT NS OFF
TEMP Sensor OPT OFF OFF
IOMUX and IO Wakeup EN DIS w/ WAKE
Wake Sources N/A ANY IRQ PD0 IRQ IOMUX, NRST, SWD
(1) If STOP0 is entered from RUN1 (SYSOSC enabled but MCLK sourced from LFCLK), SYSOSC remains enabled as it was in RUN1, and ULPCLK remains at 32KHz as it was in RUN1. If STOP0 is entered from RUN2 (SYSOSC was disabled and MCLK was sourced from LFCLK), SYSOSC remains disabled as it was in RUN2, and ULPCLK remains at 32KHz as it was in RUN2.
(2) When using the STANDBY1 policy for STANDBY, only specific peripherals (TIMG0, TIMG8, and RTC) are clocked. Other PD0 peripherals can generate an asynchronous fast clock request upon external activity but are not actively clocked.
(3) For ADCx and GPIO Ports A and B, the digital logic is in PD0 and the register interface is in PD1. These peripherals support fast single-cycle register access when PD1 is active and also support basic operation down to STANDBY mode where PD0 is still active.
(4) SYSPLL is not automatically disabled, and needs to be manually disabled through the HSCLKEN.SYSPLLEN field within the SYSCTL registers in order to reduce power consumption.