NEW

MSPM0G3105

ACTIVE

80MHz Arm® Cortex®-M0+ MCU with 32KB flash 16KB SRAM 2x12-bit 4Msps ADC, op-amp, CAN-FD

Product details

Frequency (MHz) 80 Flash memory (kByte) 32 RAM (kByte) 16 ADC type 12-bit SAR Number of ADC channels 6, 11 Number of GPIOs 16, 24, 28 UART 4 Number of I2Cs 2 SPI 2 Features 5-V-tolerant I/Os, AES encryption, CAN FD, DMA, OpAmp, RTC Operating temperature range (°C) -40 to 125 Rating Catalog
Frequency (MHz) 80 Flash memory (kByte) 32 RAM (kByte) 16 ADC type 12-bit SAR Number of ADC channels 6, 11 Number of GPIOs 16, 24, 28 UART 4 Number of I2Cs 2 SPI 2 Features 5-V-tolerant I/Os, AES encryption, CAN FD, DMA, OpAmp, RTC Operating temperature range (°C) -40 to 125 Rating Catalog
VQFN (RHB) 32 25 mm² 5 x 5 VSSOP (DGS) 20 24.99 mm² 5.1 x 4.9 VSSOP (DGS) 28 34.79 mm² 7.1 x 4.9
  • Core
    • Arm 32-bit Cortex-M0+ CPU with memory protection unit, frequency up to 80 MHz
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 128KB of flash memory with built-in error correction code (ECC)
    • Up to 32KB of SRAM with hardware parity
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4-Msps analog-to-digital converters (ADCs) with up to 11 external channels
      • 14-bit effective resolution at 250-ksps with hardware averaging
    • One general-purpose amplifier (GPAMP)
    • Configurable 1.4-V or 2.5-V internal shared voltage reference (VREF)
    • Integrated temperature sensor
    • Integrated supply monitor
  • Optimized low-power modes
    • RUN: 96 µA/MHz (CoreMark)
    • SLEEP: 467 µA at 4 MHz
    • STOP: 46 µA at 32 kHz
    • STANDBY: 1.5 µA with RTC and SRAM retention
    • SHUTDOWN: 80 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 7-channel DMA controller
    • Two 16-bit advanced control timers support dead band insertion and fault handling
    • Seven timers supporting up to 22 PWM channels
      • One 16-bit general purpose timer
      • One 16-bit general purpose timer supports QEI
      • Two 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband
    • Two window-watchdog timers
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Four UART interfaces; one supports LIN, IrDA, DALI, Smart Card, Manchester, and three support low-power operation in STANDBY mode
    • Two I 2C interfaces supporting up to FM+ (1 Mbit/s), SMBus, PMBus, and wakeup from STOP mode
    • Two SPIs, one SPI supports up to 32 Mbits/s
    • One Controller Area Network (CAN) interface supports CAN 2.0 A or B and CAN-FD
  • Clock system
    • Internal 4- to 32-MHz oscillator with up to ±3% accuracy (SYSOSC) across temperature
    • Phase-locked loop (PLL) up to 80 MHz
    • Internal 32-kHz oscillator (LFOSC)
    • External 4- to 48-MHz crystal oscillator (HFXT)
    • External 32-kHz crystal oscillator(LFXT)
    • External clock input
  • Data integrity and encryption
    • Cyclic redundancy checker (CRC-16, CRC-32)
    • True random number generator (TRNG)
    • AES encryption with 128 or 256-bit key
  • Flexible I/O features
    • Up to 28 GPIOs
      • Two 5-V tolerant IOs
      • Two high-drive IOs with 20-mA drive strength
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN
    • 28-pin VSSOP
    • 20-pin VSSOP
  • Family members (also see Device Comparison)
    • MSPM0G3105: 32KB flash, 16KB RAM
    • MSPM0G3106: 64KB flash, 32KB RAM
    • MSPM0G3107: 128KB flash, 32KB RAM
  • Development kits and software (also see Tools and Software)
  • Core
    • Arm 32-bit Cortex-M0+ CPU with memory protection unit, frequency up to 80 MHz
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 128KB of flash memory with built-in error correction code (ECC)
    • Up to 32KB of SRAM with hardware parity
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4-Msps analog-to-digital converters (ADCs) with up to 11 external channels
      • 14-bit effective resolution at 250-ksps with hardware averaging
    • One general-purpose amplifier (GPAMP)
    • Configurable 1.4-V or 2.5-V internal shared voltage reference (VREF)
    • Integrated temperature sensor
    • Integrated supply monitor
  • Optimized low-power modes
    • RUN: 96 µA/MHz (CoreMark)
    • SLEEP: 467 µA at 4 MHz
    • STOP: 46 µA at 32 kHz
    • STANDBY: 1.5 µA with RTC and SRAM retention
    • SHUTDOWN: 80 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 7-channel DMA controller
    • Two 16-bit advanced control timers support dead band insertion and fault handling
    • Seven timers supporting up to 22 PWM channels
      • One 16-bit general purpose timer
      • One 16-bit general purpose timer supports QEI
      • Two 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit general-purpose timer
      • Two 16-bit advanced timers with deadband
    • Two window-watchdog timers
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Four UART interfaces; one supports LIN, IrDA, DALI, Smart Card, Manchester, and three support low-power operation in STANDBY mode
    • Two I 2C interfaces supporting up to FM+ (1 Mbit/s), SMBus, PMBus, and wakeup from STOP mode
    • Two SPIs, one SPI supports up to 32 Mbits/s
    • One Controller Area Network (CAN) interface supports CAN 2.0 A or B and CAN-FD
  • Clock system
    • Internal 4- to 32-MHz oscillator with up to ±3% accuracy (SYSOSC) across temperature
    • Phase-locked loop (PLL) up to 80 MHz
    • Internal 32-kHz oscillator (LFOSC)
    • External 4- to 48-MHz crystal oscillator (HFXT)
    • External 32-kHz crystal oscillator(LFXT)
    • External clock input
  • Data integrity and encryption
    • Cyclic redundancy checker (CRC-16, CRC-32)
    • True random number generator (TRNG)
    • AES encryption with 128 or 256-bit key
  • Flexible I/O features
    • Up to 28 GPIOs
      • Two 5-V tolerant IOs
      • Two high-drive IOs with 20-mA drive strength
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN
    • 28-pin VSSOP
    • 20-pin VSSOP
  • Family members (also see Device Comparison)
    • MSPM0G3105: 32KB flash, 16KB RAM
    • MSPM0G3106: 64KB flash, 32KB RAM
    • MSPM0G3107: 128KB flash, 32KB RAM
  • Development kits and software (also see Tools and Software)

MSPM0G310x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform operating at up to 80-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0G310x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option. The devices also incorporate a memory protection unit, 7-channel DMA, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, configurable internal shared voltage reference, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, five general purpose timers (with one 16-bit general-purpose timer for QEI interface, two 16-bit general-purpose timers for STANDBY mode, and one 32-bit general-purpose timer), two windowed-watchdog timers, and one RTC with alarm and calendar mode. These devices provide data integrity and encryption peripherals (CRC , TRNG, AES) and enhanced communication interfaces (four UART, two I2C, two SPI , CAN 2.0/FD).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G310x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual.

MSPM0G310x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform operating at up to 80-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0G310x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option. The devices also incorporate a memory protection unit, 7-channel DMA, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, configurable internal shared voltage reference, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, five general purpose timers (with one 16-bit general-purpose timer for QEI interface, two 16-bit general-purpose timers for STANDBY mode, and one 32-bit general-purpose timer), two windowed-watchdog timers, and one RTC with alarm and calendar mode. These devices provide data integrity and encryption peripherals (CRC , TRNG, AES) and enhanced communication interfaces (four UART, two I2C, two SPI , CAN 2.0/FD).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G310x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Drop-in replacement with upgraded functionality to the compared device
NEW MSPM0G3106 ACTIVE 80MHz Arm® Cortex®-M0+ MCU with 64KB flash 32KB SRAM 2x12-bit 4Msps ADC, op-amp, CAN-FD With 64-KB flash memory

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 52
Type Title Date
* Data sheet MSPM0G310xMixed-Signal MicrocontrollersWith CAN-FD Interface datasheet (Rev. C) PDF | HTML 09 Oct 2023
* Errata MSPM0G350x, MSPM0G150x Mixed-Signal Microcontrollers Errata (Rev. A) PDF | HTML 09 Oct 2023
* User guide MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual (Rev. A) PDF | HTML 11 Jun 2024
Application note MSPM0G3507 Low Power Test and Guidance PDF | HTML 18 Oct 2024
Application note MSPM0 Design Flow Guide (Rev. D) PDF | HTML 16 Oct 2024
Application note MSPM0 ADC Noise Analysis and Application PDF | HTML 15 Oct 2024
Application note Understanding the MSPM0 Debug Subsystem PDF | HTML 23 Sep 2024
Application note MSPM0 Bootloader (BSL) Implementation (Rev. C) 10 Sep 2024
Subsystem design DMA Ping Pong With ADC (Rev. A) 06 Sep 2024
Subsystem design Frequency Counter: Tone Detection PDF | HTML 05 Sep 2024
Functional safety information MSPM0G Functional Safety Manual PDF | HTML 28 Mar 2024
Subsystem design Data Sensor Aggregator Subsystem Design PDF | HTML 05 Jan 2024
Subsystem design ADC to I2C PDF | HTML 22 Dec 2023
Subsystem design ADC to SPI PDF | HTML 22 Dec 2023
Subsystem design ADC to UART PDF | HTML 22 Dec 2023
Application note Migration Guide From STM8 to MSPM0 PDF | HTML 06 Dec 2023
Application note Operating Time of MSPM0 Powered by a Capacitor PDF | HTML 03 Oct 2023
Application brief Build Scalability in Cordless Power and Garden Tools Using Low-Cost MSPM0 MCUs (Rev. A) PDF | HTML 27 Sep 2023
Application brief Designing Single- and Three-Axis Selfie Sticks With MSPM0 MCUs (Rev. A) PDF | HTML 21 Sep 2023
Application brief BLDC and PMSM Control Using Sensorless FOC Algorithm Based on MSPM0 MCUs (Rev. A) PDF | HTML 14 Sep 2023
Application brief Using MSPM0 MCUs to Design Trapezoidal-Based BLDC Motor Controllers (Rev. A) PDF | HTML 14 Sep 2023
Application note MSPM0 G 系列 MCU 硬體開發指南 (Rev. B) PDF | HTML 28 Jun 2023
Application note MSPM0 G-시리즈 MCU 하드웨어 개발 가이드 (Rev. B) PDF | HTML 27 Jun 2023
Application note MSPM0 G-Series MCUs Hardware Development Guide (Rev. B) PDF | HTML 15 Jun 2023
Application note EEPROM Emulation Type A Solution PDF | HTML 18 Apr 2023
Application note STM32에서 Arm 기반 MSPM0으로의 마이그레이션 가이드 (Rev. A) PDF | HTML 12 Apr 2023
Application note 從 STM32 到 Arm 架構的 MSPM0 移轉指南 (Rev. A) PDF | HTML 12 Apr 2023
Application note EEPROM Emulation Type B Design PDF | HTML 11 Apr 2023
Application note MSPM0 MCU 快速參考指南 (Rev. A) PDF | HTML 11 Apr 2023
Application note MSPM0 MCU 빠른 참조 가이드 (Rev. A) PDF | HTML 11 Apr 2023
Application brief Designing Single- and Three-Axis Selfie Sticks With MSPM0 MCUs PDF | HTML 02 Mar 2023
Application brief Increasing Flexibility in Your Battery Management Designs With a Low-Cost MSPM0 PDF | HTML 02 Mar 2023
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A) PDF | HTML 02 Mar 2023
Application brief Optimizing Field Sensor and Transmitter Applications With MSPM0 MCUs PDF | HTML 02 Mar 2023
Application brief Simplifying Pulse Oximeter Designs With Low-Cost Highly Integrated MSPM0 MCUs PDF | HTML 02 Mar 2023
Subsystem design 5-V Interface PDF | HTML 01 Mar 2023
Subsystem design Common Amplifier Topologies: PGA PDF | HTML 01 Mar 2023
Subsystem design LED Driver With PWM PDF | HTML 01 Mar 2023
Application note Migration Guide From STM32 to Arm-Based MSPM0 (Rev. A) PDF | HTML 01 Mar 2023
User guide MSPM0 Bootloader User's Guide PDF | HTML 28 Feb 2023
Application note MSPM0 MCUs Quick Reference Guide (Rev. A) PDF | HTML 28 Feb 2023
Subsystem design Thermistor Temperature Sensing PDF | HTML 28 Feb 2023
Subsystem design Transimpedance Amplifier PDF | HTML 28 Feb 2023
Application note Cybersecurity Enablers in MSPM0 MCUs PDF | HTML 22 Feb 2023
Application note MSPM0 G-Series MCUs Power Optimization Guide PDF | HTML 22 Feb 2023
Product overview MSPM0 MCUs: More Options, Unlimited Possibilities PDF | HTML 22 Feb 2023
White paper MSPM0: Idea to Product With Easy-to-Use Tools, Software, and Academy PDF | HTML 22 Feb 2023
Application note Make System Design Easy With MSPM0 Precision Analog PDF | HTML 22 Feb 2023
Product overview MSPM0 MCU: 더 많은 옵션, 무한한 가능성 PDF | HTML 24 Jan 2023
Product overview MSPM0 MCU:更多選項,無限可能 PDF | HTML 24 Jan 2023
Application note MSPM0L or MSPM0G: How to Pick the Right MSP Microcontroller for Your Application PDF | HTML 13 Dec 2022
Subsystem design MCU Design Techniques: ADC to PWM PDF | HTML 12 Oct 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

LP-MSPM0G3507 — MSPM0G3507 LaunchPad™ development kit for 80-MHz Arm® Cortex®-M0+ MCU

The LP-MSPM0G3507 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) based on the MSPM0G3507. It contains everything needed to start developing on the MSPM0G3507 M0+ MCU platform, including on-board debug probe for programming, debugging and energy measurements. The board (...)

User guide: PDF | HTML
Not available on TI.com
Debug probe

TMDSEMU110-U — XDS110 JTAG Debug Probe

The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all (...)

User guide: PDF
Not available on TI.com
Hardware programming tool

MSP-GANG — MSP-GANG production programmer

The MSP Gang Programmer (MSP-GANG) is a MSPM0/MSP430™/MSP432™ device programmer that can program up to eight identical MSPM0/MSP430/MSP432 Flash or FRAM devices at the same time. It connects to a host PC using a standard RS-232 or USB connection and provides flexible (...)

User guide: PDF | HTML
Not available on TI.com
Driver or library

MSPM0-DIAGNOSTIC-LIB — MSPM0 diagnostic library for functional safety applications

The MSPM0 diagnostic library software development kit (SDK) is a collection of functional safety software to assist customers to meet their functional safety diagnostic requirements.
IDE, configuration, compiler or debugger

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)
Software programming tool

UNIFLASH — UniFlash flash programming tool

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

Package Pins CAD symbols, footprints & 3D models
VQFN (RHB) 32 Ultra Librarian
VSSOP (DGS) 20 Ultra Librarian
VSSOP (DGS) 28 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos