SBOS900B September 2018 – June 2019 OPA2156
The OPA2156 op amp is capable of driving a variety of loads with a power-supply voltage up to ±18 V and full operating temperature range. Internal power dissipation increases when operating at high supply voltages and/or high output currents. Copper leadframe construction used in the OPA2156 improves heat dissipation compared to conventional materials. Circuit board layout can also help minimize junction temperature rise. Wide copper traces help dissipate the heat by acting as an additional heat sink. Temperature rise can be further minimized by soldering the devices to the circuit board rather than using a socket.
The OPA2156 has an internal thermal protection feature which prevents it from being damaged due to self heating, or the internal heating generated during normal operation. The protection circuitry works by monitoring the temperature of the output stage and turns of the output drive if the junction temperature of the device rises to approximately 170°C. The device has a thermal hysteresis of approximately 15°C, which allows the device to safely cool down before returning to normal operation at approximately 155°C. TI recommends that the system design takes into account the thermal dissipation of the OPA2156 to ensure that the recommended operating junction temperature of 125°C is not exceeded to avoid decreasing the lifespan of the device or permanently damaging the amplifier.