SBOS900B September   2018  – June 2019 OPA2156

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Low Input Voltage Noise Spectral Density
      2.      OPA2156 Transimpedance Configuration
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA2156
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Electrical Overstress
      3. 7.3.3 Thermal Considerations
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Common-Mode Voltage Range
      6. 7.3.6 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Slew Rate Limit for Input Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Dissipation
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3 Thermal Considerations

Through normal operation the OPA2156 will experience self-heating, a natural increase in the die junction temperature which occurs in every amplifier. This is a result of several factors including the quiescent power consumption, the package’s thermal dissipation, PCB layout and the device operating conditions.

To fully ensure the amplifier will operate without entering thermal shutdown it is important to calculate the approximate junction (die) temperature which can be done using Equation 1.

Equation 1. OPA2156 Eq1-JunctionTemp.gif

Equation 2 shows the approximate junction temperature for the OPA2156 while unloaded with an ambient temperature of 25°C.

Equation 2. OPA2156 Eq1-JunctionTemp-Calc.gif

For high voltage, high precision amplifiers such as the OPA2156 the junction temperature can easily be 10s of degrees higher than the ambient temperature in a quiescent (unloaded) condition. If the device then begins to drive a heavy load the junction temperature may rise and trip the thermal shutdown circuit. The Figure 44 shows the maximum output voltage of the OPA2156 without entering thermal shutdown vs ambient temperature in both a loaded and unloaded condition.

OPA2156 OPA2156 Thermal SOA.gifFigure 44. OPA2156 Thermal Safe Operating Area