SBOS957F February   2022  – October 2025 OPA2328 , OPA328 , OPA4328

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - OPA328
    5. 5.5 Thermal Information - OPA2328
    6. 5.6 Thermal Information - OPA4328
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input and ESD Protection
      2. 6.3.2 Rail-to-Rail Input
      3. 6.3.3 Phase Reversal
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Capacitive Load and Stability
    2. 7.2 Typical Applications
      1. 7.2.1 Bidirectional Current-Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Transimpedance Amplifier
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 8.1.1.3 DIP-Adapter-EVM
        4. 8.1.1.4 DIYAMP-EVM
        5. 8.1.1.5 Analog Filter Designer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • DRG|8
  • YBJ|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision E (January 2025) to Revision F (October 2025)

  • Changed OPA4328 device status from preview to production dataGo
  • Deleted OPA4328 RUM (WQFN, 16) preview package option from data sheetGo
  • Updated OPA2328 (WCSP, 24) pinout orientation and added shutdown functionalityGo
  • Added the following footnote to the input bias current maximum: "Specification established from device population bench system measurements across multiple lots."Go
  • Added the following footnote to the input offset current maximum: "Specification established from device population bench system measurements across multiple lots."Go

Changes from Revision D (December 2023) to Revision E (January 2025)

  • Added OPA2328 YBJ package to Device Information Go
  • Added OPA2328 YBJ (WCSP, 24) pin configuration and pin functions tableGo
  • Added YBJ (DSBGA) package to Thermal Information - OPA2328 Go

Changes from Revision C (May 2023) to Revision D (December 2023)

  • Changed OPA2328 D (SOIC, 8) and DRG (WSON, 8) package status from preview to production data (active) and added associated content Go

Changes from Revision B (November 2022) to Revision C (May 2023)

  • Changed OPA328 DBV (SOT-23, 5) package from advanced information (preview) to production data (active) Go
  • Added OPA4328 PW (TSSOP, 14) and RUM (WQFN, 16) pin configurations and pin functions tableGo

Changes from Revision A (June 2022) to Revision B (November 2022)

  • Changed OPA328 device status from preview to advanced informationGo
  • Added junction temperature to Absolute Maximum Ratings Go

Changes from Revision * (February 2022) to Revision A (June 2022)

  • Changed OPA2328 from advanced information (preview) to production data (active)Go