SBOS382H may   2008  – june 2023 OPA2673

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Family Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Full Bias and Offline Mode VS = ±6 V
    6. 7.6  Electrical Characteristics: 75% Bias Mode VS = ±6 V
    7. 7.7  Electrical Characteristics: 50% Bias Mode VS = ±6 V
    8. 7.8  Typical Characteristics: VS = ±6 V, Full Bias
    9. 7.9  Typical Characteristics: VS = ±6 V Differential, Full Bias
    10. 7.10 Typical Characteristics: VS = ±6 V, 75% Bias
    11. 7.11 Typical Characteristics: VS = ±6 V, 50% Bias
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Suggestions
        1. 8.3.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 8.3.1.2 Output Current and Voltage
        3. 8.3.1.3 Driving Capacitive Loads
        4. 8.3.1.4 Line Driver Headroom Model
        5. 8.3.1.5 Noise Performance
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Speed Active Filter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 PLC Line Driver
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Thermal Analysis
      2. 9.3.2 Input and ESD Protection
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 TINA-TI™ Simulation Software (Free Download)
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.1 Thermal Analysis

As a result of the high-output power capability of the OPA2673, heat-sinks or forced airflow can be required under extreme operating conditions. The maximum desired junction temperature sets the maximum allowed internal power dissipation, and is described in the following paragraph. Do not exceed the maximum junction temperature of 150°C.

Operating junction temperature (TJ) is given by:

Equation 13. TJ = TA + PD × θJA

The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipation in the output stage (PDL) to deliver load power. Quiescent power is the specified no-load supply current times the total supply voltage across the part. The PDL depends on the required output signal and load; for a grounded resistive load, however, PDL is at a maximum when the output is fixed at a voltage equal to 1/2 of either supply voltage (for equal bipolar supplies). Under this condition,

Equation 14. PDL = VS2 / (4 × RL)

where RL includes feedback network loading.

Equation 14 is the power dissipated at the output stage of OPA2673 that determines the internal power dissipation.

As a worst-case example, compute the maximum TJ using an OPA2673 VQFN-16 in the circuit of Figure 8-1 operating at the maximum specified ambient temperature of 85°C with both outputs driving a grounded 20‑Ω load to 2.5 V.

Equation 15. PD = 12 V × 33 mA + 2 × [52 / (4 × [20 Ω ∥ 535 Ω])] = 1.05 W
Equation 16. Maximum TJ = +85°C + (1.05 × 45°C/W) = 132.2°C

The output V-I plot in Output Current and Voltage includes a boundary for 2-W maximum internal power dissipation under these conditions.