SBOS382H may   2008  – june 2023 OPA2673

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Family Comparison Table
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Full Bias and Offline Mode VS = ±6 V
    6. 7.6  Electrical Characteristics: 75% Bias Mode VS = ±6 V
    7. 7.7  Electrical Characteristics: 50% Bias Mode VS = ±6 V
    8. 7.8  Typical Characteristics: VS = ±6 V, Full Bias
    9. 7.9  Typical Characteristics: VS = ±6 V Differential, Full Bias
    10. 7.10 Typical Characteristics: VS = ±6 V, 75% Bias
    11. 7.11 Typical Characteristics: VS = ±6 V, 50% Bias
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Suggestions
        1. 8.3.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 8.3.1.2 Output Current and Voltage
        3. 8.3.1.3 Driving Capacitive Loads
        4. 8.3.1.4 Line Driver Headroom Model
        5. 8.3.1.5 Noise Performance
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Speed Active Filter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 PLC Line Driver
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Thermal Analysis
      2. 9.3.2 Input and ESD Protection
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 TINA-TI™ Simulation Software (Free Download)
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.