SBOS969E October   2019  – May 2021 OPA2991 , OPA4991 , OPA991

PRODMIX  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Protection Circuitry
      2. 7.3.2  EMI Rejection
      3. 7.3.3  Thermal Protection
      4.     
      5. 7.3.4  Capacitive Load and Stability
      6. 7.3.5  Common-Mode Voltage Range
      7. 7.3.6  Phase Reversal Protection
      8. 7.3.7  Electrical Overstress
      9. 7.3.8  Overload Recovery
      10. 7.3.9  Typical Specifications and Distributions
      11. 7.3.10 Packages With an Exposed Thermal Pad
      12. 7.3.11 Shutdown
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision D (July 2020) to Revision E (May 2021)

  • Deleted preview notation from X2QFN-14 (RUC) package in Device Information Go
  • Deleted preview notation from VSSOP-8 (DGK) package in Device Information Go
  • Removed preview notation from X2QFN-14 (RUC) package in Pin Configuration and Functions section Go
  • Removed preview notation from VSSOP-8 (DGK) in Pin Configuration and Functions section Go
  • Removed Table of Graphs from the Specifications sectionGo

Changes from Revision C (May 2020) to Revision D (July 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the document.Go
  • Deleted preview notation from SOIC-14 (D) package in Device Information Go
  • Deleted preview notation from SOT-23-5 (DBV) package in Device Information Go
  • Deleted preview notation from SOT-23-6 (DBV) package in Device Information Go
  • Deleted preview notation from SC70 (DCK) package in Device Information Go
  • Deleted preview notation from SOT-23-8 (DDF) package in Device Information Go
  • Deleted preview notation from TSSOP-14 (PW) package in Device Information Go
  • Removed preview notation on SOT-23-5 (DBV), and SC70 (DCK)Go
  • Clarified SHDN notation in the OPA991S Pin Configuration and Functions section Go
  • Removed preview notation from SOT-23-6 (DBV) package in Pin Configuration and Functions section Go
  • Removed preview notation from SOT-23-8 (DDF) package in Pin Configuration and Functions section Go
  • Clarified SHDN notation in OPA2991S Pin Configuration and Functions section Go
  • Removed preview notation from SOIC-14 (D) and TSSOP-14 (PW) packages in Pin Configuration and Functions section Go
  • Clarified SHDN notation in OPA4991S Pin Configuration and Functions section Go

Changes from Revision B (May 2020) to Revision C (May 2020)

  • Removed preview notation from TSSOP (PW) package in Pin Configuration and Functions section Go
  • Removed preview notation from X2QFN (RUG) package in Pin Configuration and Functions section Go

Changes from Revision A (December 2019) to Revision B (May 2020)

  • Added OPA991 and OPA4991 devices to the data sheetGo
  • Deleted preview notation from WSON (DSG) package in Device Information Go
  • Changed X2QFN (10) dimension in Device Information section Go
  • Changed formatting of Pin Functions tables to align with data sheet standardsGo
  • Deleted preview notation from WSON (DSG) package in Pin Configuration and Functions section Go

Changes from Revision * (October 2019) to Revision A (December 2019)

  • Changed OPA2991 device status from Advance Information to Production Data Go
  • Removed preview notation from SOIC (D) package in Device Information Go
  • Removed preview notation from SOIC (D) package in Pin Configuration and Functions sectionGo
  • Added Typical Characteristics section in Specifications sectionGo
  • Added additional references in Related Documentation sectionGo