SBOS940A May   2019  – March 2020 OPA818

PRODUCTION DATA.  

  1. Features
  2. Applications
    1.     High-Speed Optical Front-End
  3. Description
    1.     Photodiode Capacitance vs 3-dB Bandwidth
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Typical Characteristics: VS = ±5 V
    7. 7.7 Typical Characteristics: VS = 6 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and ESD Protection
      2. 8.3.2 Feedback Pin
      3. 8.3.3 Decompensated Architecture With Wide Gain-Bandwidth Product
      4. 8.3.4 Low Input Capacitance
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (+4/–2 V to ±6.5 V)
      2. 8.4.2 Single-Supply Operation (6 V to 13 V)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Wideband, Non-Inverting Operation
      2. 9.1.2 Wideband, Transimpedance Design Using OPA818
    2. 9.2 Typical Applications
      1. 9.2.1 High Bandwidth, 100-kΩ Gain Transimpedance Design
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Non-Inverting Gain of 2 V/V
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.